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UJA1078ATW/5V0,118

NXP Semiconductors

UJA1078ATW/5V0,118 by NXP Semiconductors

UJA1078ATW/5V0,118 by NXP is a CAN transceiver designed for automotive applications, supporting data rates up to 1 Mbps. It operates within a voltage range of 4.5-28 V and withstands temperatures from -40 °C to 125 °C. This compact device features a small outline package with 32 terminals for efficient integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

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4,000

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Vyrian

USA . 7,969 parts In-Stock

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7,969

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Flip Electronics

USA . 4,000 parts In-Stock

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4,000

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Digiode

USA . 3,311 parts In-Stock

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Anansix

USA . 282 parts In-Stock

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282

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Microchip USA

USA . 2,919 parts In-Stock

1+ parts

$3.069

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2,919

$3.069

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AZTECH Wire

Italy . 452 parts In-Stock

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$8.020

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452

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Component Stockers USA

USA . 400 parts In-Stock

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$99.990

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400

$99.990

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One Stop Electronics

USA . 975 parts In-Stock

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$560.000

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Corphita

USA . 2,122 parts In-Stock

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UNI Independent Distributors

Spain . 917 parts In-Stock

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917

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Overview

Elevate your automotive designs with the UJA1078ATW/5V0,118 from NXP Semiconductors, a leader in innovation and quality. This state-of-the-art CAN transceiver ensures robust communications in demanding applications, delivering unmatched reliability and performance. With its AEC-Q100 certification, it's built to thrive in extreme conditions, offering peace of mind for your projects. Trust in NXP's expertise to enhance your systems—unlock efficiency and drive your success today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic and epoxy construction ensures reliable performance in various environments.

Surface Mount: YES

Surface mount capability allows for efficient PCB design and assembly, leading to reduced manufacturing costs.

Screening Level: AEC-Q100

Meets stringent automotive quality standards, ensuring reliability in automotive applications.

Package Shape: RECTANGULAR

Rectangular shape supports effective space utilization on the PCB.

Power Supplies (V): 4.5/28

Wide power supply range offers flexibility for various applications, including automotive systems.

No. of Terminals: 32

A high number of terminals provides extensive connectivity options for complex systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Compact design minimizes space requirements while allowing for effective heat dissipation.

Maximum Operating Temperature: 125 °C

High maximum temperature rating ensures performance in demanding environments.

Minimum Operating Temperature: -40 °C

Extended low temperature range makes this product suitable for harsh conditions and applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position provides versatility in layout and design adaptability.

Maximum Seated Height: 1.1 mm

Low-profile design minimizes height while maintaining functionality, ideal for compact devices.

Width: 6.1 mm

Compact width allows for space-efficient PCB layouts.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures compatibility with various soldering processes.

Length: 11 mm

Short length fits well within small electronic designs, promoting efficient use of board space.

Temperature Grade: AUTOMOTIVE

Engineered for automotive applications, providing confidence in performance and reliability.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and good mechanical strength.

Maximum Supply Current: 0.000099 mA

Ultra-low supply current enhances energy efficiency, making it suitable for low-power applications.

Telecom IC Type: CAN TRANSCEIVER

Designed for Controller Area Network applications, ensuring robust communication in vehicles.

Nominal Supply Voltage: 14 V

Optimized for automotive nominal voltage, ensuring reliable operation in vehicle systems.

Terminal Pitch: 0.65 mm

Tightly spaced terminal pitch supports dense PCB designs for advanced functionalities.

Data Rate: 1 Mbps

Supports a high data rate, making it suitable for real-time communications in automotive systems.

Technical Specifications

Network Interfaces UJA1078ATW/5V0,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.000099 mA

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

UJA1078ATW/5V0,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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