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UJA1078ATW/3V3WD,1

NXP Semiconductors

UJA1078ATW/3V3WD,1 by NXP Semiconductors

UJA1078ATW/3V3WD,1 from NXP is a CAN transceiver designed for automotive applications, operating b/w -40 °C to 125 °C. It features a 32-terminal dual layout with a data rate of 1 Mbps and supports power supplies from 4.5V to 28V. Its compact design ensures efficient surface mounting in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,537 parts In-Stock

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2,537

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Digiode

USA . 1,816 parts In-Stock

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1,816

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Anansix

USA . 977 parts In-Stock

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977

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Distributors (Availability)

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AZTECH Wire

Italy . 488 parts In-Stock

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$14.860

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488

$14.860

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One Stop Electronics

USA . 208 parts In-Stock

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$314.000

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208

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Microchip USA

USA . 3,758 parts In-Stock

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3,758

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UNI Independent Distributors

Spain . 3,646 parts In-Stock

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3,646

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Corphita

USA . 1,168 parts In-Stock

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Overview

Elevate your automotive designs with the UJA1078ATW/3V3WD by NXP Semiconductors. This high-performance CAN transceiver ensures seamless communication, backed by AEC-Q100 certification for reliability in demanding environments. With its compact design and superior thermal performance, it excels in various applications—from advanced driver-assistance systems to smart vehicle networks. Choose UJA1078ATW for unmatched quality and innovation that propels your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology facilitates compact PCB design, allowing for more efficient use of space in network interface applications.

Screening Level: AEC-Q100

This automotive-grade screening level ensures high reliability and performance in critical applications, suitable for automotive environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on PCBs and optimizes space management within the overall design.

Power Supplies (V): 4.5/28

A wide operating voltage range enhances compatibility with various power systems, providing flexible integration options.

No. of Terminals: 32

Having 32 terminals allows for a versatile connection interface, accommodating multiple inputs and outputs for complex networking tasks.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This style supports efficient thermal management and allows for a compact footprint, ideal for space-constrained environments.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature means the product can function effectively under demanding thermal conditions, ensuring long-term reliability.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures makes this device suitable for harsh environments, such as automotive applications.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and resists corrosion, ensuring durability in electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for streamlined connectivity options, improving the flexibility of design implementations.

Maximum Seated Height: 1.1 mm

A low profile minimizes the spatial impact on the PCB, contributing to a compact and sleek device design.

Width: 6.1 mm

The compact width facilitates integration in tight layouts, making it an ideal choice for space-limited applications.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures ensures compatibility with standard soldering processes in manufacturing.

Length: 11 mm

Short length helps maintain a reduced footprint, allowing efficient board space utilization without sacrificing functionality.

Temperature Grade: AUTOMOTIVE

Built to meet automotive standards, ensuring reliable performance in vehicles and under varying environmental conditions.

Terminal Form: GULL WING

Gull wing terminals provide enhanced mechanical stability and ease of handling during assembly, promoting reliable solder connections.

Maximum Supply Current: 0.000099 mA

Extremely low current consumption leads to improved energy efficiency, ideal for battery-operated network applications.

Telecom IC Type: CAN TRANSCEIVER

Being a CAN transceiver allows for robust communication in vehicle networking, aligning well with automotive communication protocols.

Nominal Supply Voltage: 14 V

This nominal voltage specification is optimal for automotive systems, ensuring compatibility with regular automotive power supplies.

Terminal Pitch: 0.65 mm

The small pitch enables a compact design that can fit into tighter layouts while maintaining the ease of soldering.

Data Rate: 1 Mbps

A data rate of 1 Mbps supports efficient data transmission, meeting the needs of modern networking applications.

Technical Specifications

Network Interfaces UJA1078ATW/3V3WD,1 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.000099 mA

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

UJA1078ATW/3V3WD,1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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