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TJF1051T/3/1U

NXP Semiconductors

TJF1051T/3/1U by NXP Semiconductors

TJF1051T/3/1U by NXP Semiconductors is a network interface with 8 terminals, small outline package style, and temperature grade suitable for automotive applications. It supports circuit in telecom ICs and operates at a voltage of 5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,876 parts In-Stock

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2,876

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Anansix

USA . 1,691 parts In-Stock

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1,691

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Digiode

USA . 1,464 parts In-Stock

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1,464

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$6.124

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423

$6.124

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Corohmni

South Africa . 1,153 parts In-Stock

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$14.134

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1,153

$14.134

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Aztec Data Supply Inc.

USA . 1,400 parts In-Stock

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$14.850

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1,400

$14.850

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Microchip USA

USA . 443 parts In-Stock

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$18.506

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443

$18.506

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Semicontronic

India . 1,366 parts In-Stock

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$338.000

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$329.550

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$327.860

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1,366

$338.000

$329.550

$327.860

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Ampacity Inc.

Singapore . 397 parts In-Stock

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$693.000

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397

$693.000

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One Stop Electronics

USA . 1,506 parts In-Stock

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$772.000

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1,506

$772.000

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Continental Prestige Electronics

USA . 5,461 parts In-Stock

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5,461

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Corphita

USA . 2,643 parts In-Stock

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2,643

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UNI Independent Distributors

Spain . 1,457 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Argo Parts USA

USA . 305 parts In-Stock

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305

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Overview

Discover the TJF1051T/3/1U by NXP Semiconductors, a cutting-edge Network Interface that epitomizes quality and innovation. With its superior manufacturing standards and commitment to excellence, NXP Semiconductors has crafted a product that surpasses all expectations. This versatile device finds applications in various industries, providing seamless connectivity and unparalleled performance. Experience the value and benefits it brings, from its compact design to its exceptional temperature range, making it perfect for automotive use. Unlock your potential with the TJF1051T/3/1U and elevate your network experience to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This product's use of plastic/epoxy as the package body material ensures durability and resistance to harsh environmental conditions.

Surface Mount:

YES. The surface mount feature allows for easy installation and integration into various electronic devices, making this product versatile and convenient.

No. of Functions:

1. With a single function, this network interface simplifies the design and implementation process, reducing complexity and enhancing overall efficiency.

Package Shape:

RECTANGULAR. The rectangular package shape offers a compact and space-saving design, facilitating streamlined installation and maximizing available space.

No. of Terminals:

8. This network interface provides 8 terminals, enabling efficient and reliable connections for seamless communication and data transfer.

Package Style (Meter):

SMALL OUTLINE. The small outline package style ensures compatibility with a wide range of devices and enhances the product's portability and versatility.

Maximum Operating Temperature:

125 °C. With a maximum operating temperature of 125°C, this product can withstand high-temperature environments, making it suitable for demanding applications.

Minimum Operating Temperature:

40 °C. The ability to operate reliably in low temperatures down to -40°C ensures excellent performance and functionality in cold environments.

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER. This network interface's terminal finish composition, including nickel, palladium, gold, and silver, provides excellent conductivity, corrosion resistance, and long-term reliability.

Terminal Position:

DUAL. The dual terminal position allows for flexible installation and connectivity options, enhancing the product's compatibility and ease of integration.

Maximum Seated Height:

1.75 mm. With a compact maximum seated height of 1.75 mm, this network interface can be easily incorporated into space-constrained designs without sacrificing functionality.

Width:

3.9 mm. The narrow width of 3.9 mm ensures a compact form factor, enabling easy integration into various electronic systems while minimizing space requirements.

Maximum Time At Peak Reflow Temperature (s):

30. This product's capability to withstand a maximum time of 30 seconds at peak reflow temperature ensures effective soldering processes and reliable connections during assembly.

Peak Reflow Temperature °C:

260. With a peak reflow temperature of 260°C, this network interface can endure high-temperature soldering without compromising its performance or structural integrity.

Length:

4.9 mm. The compact length of 4.9 mm contributes to the product's overall small footprint, enabling easy integration into space-limited applications.

Temperature Grade:

AUTOMOTIVE. Designed to meet automotive industry standards, this network interface can withstand challenging automotive environments, ensuring reliability in vehicular applications.

Terminal Form:

GULL WING. The gull wing terminal form offers secure and reliable soldering connections, enhancing the product's stability and ensuring optimal electrical performance.

Telecom IC Type:

SUPPORT CIRCUIT. Equipped with a support circuit telecom IC type, this network interface provides enhanced functionality and compatibility for telecom applications.

Nominal Supply Voltage:

5 V. Designed to operate at a nominal supply voltage of 5 V, this network interface offers reliable and stable performance with compatibility across various electronic systems.

Terminal Pitch:

1.27 mm. The terminal pitch of 1.27 mm allows for precise and secure connections, ensuring efficient data transmission and minimizing the risk of electrical interference.

Moisture Sensitivity Level (MSL):

1. With a moisture sensitivity level of 1, this network interface is protected against moisture-related issues, allowing for increased reliability and longevity.

Technical Specifications

Network Interfaces TJF1051T/3/1U attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJF1051T/3/1U Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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