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TJF1051T/3/CM,118

NXP Semiconductors

TJF1051T/3/CM,118 by NXP Semiconductors

NXP Semiconductors' TJF1051T/3/CM,118 is a Network Interface with 5V supply voltage and 1Mbps data rate. It features GULL WING terminals, operates in automotive temperature grade (-40 to 125 °C), and supports circuit applications. The small outline package has 8 terminals, measures 4.9mm x 3.9mm x 1.75mm, and is surface mountable for various telecom uses.

Median Price

$0.809

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 10,000 parts In-Stock

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Rochester

USA . 5,000 parts In-Stock

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$0.809

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$0.671

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$0.599

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$0.809

$0.671

$0.599

Distributors (In-Stock)

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Vyrian

USA . 5,163 parts In-Stock

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NAC Semi

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Anansix

USA . 2,859 parts In-Stock

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Digiode

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Nova Conductors

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Microchip USA

USA . 3,964 parts In-Stock

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$3.993

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Corohmni

South Africa . 904 parts In-Stock

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$7.358

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$13.670

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$12.987

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Aztec Data Supply Inc.

USA . 2,954 parts In-Stock

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AZTECH Wire

Italy . 863 parts In-Stock

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Semicontronic

India . 9,865 parts In-Stock

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$504.000

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$491.400

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$488.880

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Ampacity Inc.

Singapore . 9,826 parts In-Stock

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$617.000

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Unlock seamless connectivity with the TJF1051T/3/CM,118 by NXP Semiconductors. Crafted with precision and expertise, this network interface offers unparalleled reliability and performance. Ideal for automotive applications, this small outline package ensures a secure fit while delivering a data rate of 1 Mbps. Stay ahead of the curve with NXP Semiconductors, where innovation meets excellence. Elevate your connectivity experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, perfect for various applications.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving space on the PCB.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance.

Data Rate: 1 Mbps

Capable of handling data transfer speeds up to 1 Mbps, making it suitable for high-speed networking applications.

Technical Specifications

Network Interfaces TJF1051T/3/CM,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJF1051T/3/CM,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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