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TJF1051T/3

NXP Semiconductors

TJF1051T/3 by NXP Semiconductors

NXP Semiconductors' TJF1051T/3 is an Ethernet transceiver IC with 8 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial applications. The terminal finish includes nickel palladium gold silver, and it has a max seated height of 1.75mm.

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9

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Nova Conductors

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 217 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,248 parts In-Stock

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Corohmni

South Africa . 71 parts In-Stock

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Semicontronic

India . 714 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Overview

Elevate your network interfaces with the NXP Semiconductors TJF1051T/3. Crafted with precision and expertise, this Ethernet transceiver offers unparalleled performance and reliability for industrial applications. With a compact design and advanced features, this small outline package is a game-changer in the world of telecom ICs. Experience seamless connectivity and smooth data transmission with the TJF1051T/3, setting new standards in the industry. Upgrade your network systems today and witness the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the network interface, ensuring longevity and reliability.

No. of Terminals: 8

Sufficient number of terminals for connectivity, allowing for versatile and efficient use.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher operating temperatures may be encountered.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Ensures good conductivity and corrosion resistance, enhancing the performance and lifespan of the network interface.

Telecom IC Type: ETHERNET TRANSCEIVER

Specifically designed for Ethernet communication, making it compatible and optimized for network connections.

Technical Specifications

Network Interfaces TJF1051T/3 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJF1051T/3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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