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TDF8599ATH/N2/S6,5

NXP Semiconductors

TDF8599ATH/N2/S6,5 by NXP Semiconductors

TDF8599ATH/N2/S6,5 by NXP Semiconductors is a dual audio amplifier designed for industrial applications. It operates at 14.4V with a max supply current of 120mA and functions effectively in temperatures ranging from -40 °C to 85 °C. Its compact surface mount design ensures efficient integration into various audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,558 parts In-Stock

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Anansix

USA . 1,587 parts In-Stock

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Digiode

USA . 133 parts In-Stock

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Microchip USA

USA . 293 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 946 parts In-Stock

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$9.320

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One Stop Electronics

USA . 761 parts In-Stock

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$21.800

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QUARKTWIN TECHNOLOGY LTD

USA . 22,231 parts In-Stock

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UNI Independent Distributors

Spain . 5,516 parts In-Stock

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Corphita

USA . 1,823 parts In-Stock

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Overview

Elevate your audio experience with the TDF8599ATH/N2/S6,5 from NXP Semiconductors—a leader in innovative solutions. This premium audio amplifier promises exceptional sound quality and reliability, ensuring your systems deliver crystal-clear performance under diverse conditions. Its compact design and robust features make it ideal for automotive and industrial applications, providing unmatched efficiency and versatility. Choose NXP for cutting-edge technology that amplifies not just sound, but also your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact designs, enabling easier integration into modern electronic devices.

No. of Functions: 2

Having multiple functions in a single chip saves space and reduces costs, making it efficient for applications needing versatility.

Package Shape: RECTANGULAR

The rectangular shape makes it easier to design PCB layouts with optimal space utilization and chip placement.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it enhances sound quality and is ideal for audio applications, offering excellent performance.

Power Supplies (V): 14.4

Operates at a moderate voltage, ensuring compatibility with a range of power supplies while providing efficient performance.

No. of Terminals: 36

A higher number of terminals allows for more connectivity options, enhancing integration flexibility into complex circuits.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This style offers a compact footprint, making it ideal for space-constrained applications while maintaining efficient thermal performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and durability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows this amplifier to function effectively in extreme conditions, making it suitable for outdoor and industrial applications.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB design, allowing for easy layout and assembly processes.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this amplifier is engineered to withstand rigorous conditions, ensuring long-term reliability.

Technology: BCDMOS

BCD technology combines digital and analog functions efficiently, providing enhanced performance and reduced power consumption.

Terminal Form: GULL WING

Gull wing terminals ensure secure soldering to the PCB, enhancing the reliability of connections and reducing the risk of failure.

Maximum Supply Current: 120 mA

The moderate current draw allows for efficient operation while ensuring the amplifier can drive a variety of loads without overheating.

Terminal Pitch: 0.635 mm

A tight terminal pitch allows for higher density layouts, making it suitable for modern electronic designs that require compact solutions.

Technical Specifications

Audio & Video Amplifiers TDF8599ATH/N2/S6,5 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

No. of Functions:

2

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

120 mA

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TDF8599ATH/N2/S6,5 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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