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TDF8546SD/N1,112

NXP Semiconductors

TDF8546SD/N1,112 by NXP Semiconductors

TDF8546SD/N1,112 by NXP Semiconductors is a versatile audio amplifier featuring 4 functions and operates within -40 °C to 105 °C. It supports a supply voltage of 14.4V with a max current of 350mA. Ideal for industrial audio applications, it comes in a rectangular plastic package with 27 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,446 parts In-Stock

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4,446

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Vyrian

USA . 3,057 parts In-Stock

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3,057

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Anansix

USA . 2,451 parts In-Stock

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2,451

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Distributors (Availability)

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One Stop Electronics

USA . 1,129 parts In-Stock

1+ parts

$6.800

100+ parts

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1,129

$6.800

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AZTECH Wire

Italy . 1,145 parts In-Stock

1+ parts

$14.220

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1,145

$14.220

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Ampacity Inc.

Singapore . 417 parts In-Stock

1+ parts

$16.800

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417

$16.800

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QUARKTWIN TECHNOLOGY LTD

USA . 24,600 parts In-Stock

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24,600

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Microchip USA

USA . 4,685 parts In-Stock

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4,685

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UNI Independent Distributors

Spain . 3,554 parts In-Stock

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3,554

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Corphita

USA . 3,524 parts In-Stock

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3,524

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Overview

Elevate your audio experience with the TDF8546SD/N1,112 by NXP Semiconductors. Designed for superior performance and reliability, this versatile audio amplifier seamlessly integrates into a variety of applications, from automotive to industrial systems. With NXP's commitment to quality, you can trust in optimal sound fidelity and durability, ensuring long-lasting value. Enhance your projects today and enjoy unmatched efficiency and clarity that your customers will love!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures that the amplifier is lightweight and resistant to environmental factors, making it an ideal choice for various applications.

No. of Functions: 4

With four functions, this amplifier offers versatility, allowing it to serve multiple purposes, which can be cost-effective and space-saving.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization in circuit boards, making assembly easier and more organized.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this IC is specifically designed to enhance audio signals, making it perfect for high-quality sound applications.

Power Supplies (V): 14.4

Operates at a power supply of 14.4V, which is a standard voltage level, making it compatible with a wide range of audio devices.

No. of Terminals: 27

With 27 terminals, this amplifier allows for a rich array of connections, enhancing its functionality and flexibility in different setups.

Package Style (Meter): IN-LINE

The in-line package style simplifies integration into various devices, facilitating efficient installation and maintainability.

Maximum Operating Temperature: 105 °C

Designed to operate at high temperatures, making it suitable for demanding environments without compromising performance.

Minimum Operating Temperature: -40 °C

Can function in extremely low temperatures, ensuring reliable performance in harsh conditions.

Terminal Position: ZIG-ZAG

The zig-zag terminal positioning optimizes space on circuit boards, making it easier to manage connections and layout.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this amplifier meets stringent reliability standards, making it suitable for professional-grade applications.

Technology: BCDMOS

Utilizes BCDMOS technology, which enhances performance and efficiency, resulting in better sound quality and lower power consumption.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust connections and is preferred in applications requiring durability and better mechanical stability.

Maximum Supply Current: 350 mA

With a maximum current rating of 350 mA, this amplifier is capable of driving demanding audio loads efficiently.

Terminal Pitch: 1 mm

A terminal pitch of 1 mm allows for compact designs, making it easy to incorporate into space-constrained applications.

Technical Specifications

Audio & Video Amplifiers TDF8546SD/N1,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T27

No. of Functions:

4

No. of Terminals:

27

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP27H,.1,.74,40

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

350 mA

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDF8546SD/N1,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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