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TPA6205A1DRBRG4

Texas Instruments

TPA6205A1DRBRG4 by Texas Instruments

TPA6205A1DRBRG4 by Texas Instruments is an audio amplifier IC with 1.25W output power, 1% harmonic distortion, and 3/5V power supplies. It is ideal for industrial applications due to its small outline package style and wide operating temperature range from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 110,000 parts In-Stock

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Vyrian

USA . 5,729 parts In-Stock

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5,729

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Digiode

USA . 4,002 parts In-Stock

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4,002

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 659 parts In-Stock

1+ parts

$2.568

100+ parts

-

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$3.057

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659

$2.568

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$3.057

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DigiPath Technology Company

USA . 592 parts In-Stock

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$2.827

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592

$2.827

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ChromeModa Solutions

Germany . 1,571 parts In-Stock

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$2.885

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$2.366

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$2.885

$2.366

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IDEA Electronic Components Group

UK . 32 parts In-Stock

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$2.885

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$2.596

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32

$2.885

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$2.596

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One Stop Electronics

USA . 465 parts In-Stock

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$3.800

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465

$3.800

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AZTECH Wire

Italy . 526 parts In-Stock

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$5.864

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526

$5.864

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Ampacity Inc.

Singapore . 706 parts In-Stock

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$7.800

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706

$7.800

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A-Z Elektronik GmbH

Germany . 6,173 parts In-Stock

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Argo Parts USA

USA . 4,660 parts In-Stock

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Continental Prestige Electronics

USA . 2,020 parts In-Stock

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Corphita

USA . 1,160 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Elevate your audio experience with the TPA6205A1DRBRG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you this cutting-edge Audio Amplifier that delivers impeccable sound clarity with just 1% harmonic distortion. Whether you're enhancing your home entertainment system or upgrading your portable speakers, this amplifier offers a powerful 1.25W output power and a wide nominal bandwidth of 0.02 kHz to ensure an immersive listening experience. Trust in Texas Instruments to provide top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this amplifier lightweight and durable, ideal for various audio applications.

Surface Mount: YES

Being surface mountable, this amplifier is easy to install and saves space on the PCB, making it more efficient.

Package Shape: SQUARE

The square package shape allows for easy placement on the PCB and provides a compact design for confined spaces.

General IC Type: AUDIO AMPLIFIER

Specifically designed as an audio amplifier, this product ensures high-quality sound output for audio devices.

Harmonic Distortion: 1%

With low harmonic distortion, this amplifier delivers clean and clear sound, perfect for audio enthusiasts.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, this amplifier offers versatility in different voltage applications.

No. of Terminals: 8

The 8 terminals provide ample connectivity options and flexibility in circuit design for various audio setups.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style contribute to efficient heat dissipation, resulting in optimal performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this amplifier can withstand high temperatures, ensuring reliability in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this amplifier suitable for use in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances conductivity and prevents corrosion, promoting long-term reliability.

Terminal Position: DUAL

Dual terminal position offers increased connection options and flexibility in circuit configurations for customization.

Nominal Output Power: 1.25 W

Providing a nominal output power of 1.25W, this amplifier delivers sufficient power for driving various audio devices.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this amplifier is compact and space-saving, suitable for compact electronic designs.

Width: 3 mm

The 3mm width of this amplifier ensures compatibility with standard PCB layouts and facilitates easy integration into existing systems.

Technical Specifications

Audio & Video Amplifiers TPA6205A1DRBRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

1 %

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.25 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA6205A1DRBRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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