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TDF8544J/N2,112

NXP Semiconductors

TDF8544J/N2,112 by NXP Semiconductors

TDF8544J/N2,112 by NXP Semiconductors is a versatile audio amplifier featuring 4 functions and operates within -40 °C to 105 °C. It supports a power supply of 14.4V with a max current of 350mA, ideal for industrial audio applications. Its compact in-line design ensures efficient integration.

Median Price

$10.721

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 53 parts In-Stock

1+ parts

-

100+ parts

$9.530

1k+ parts

$8.530

10k+ parts

$8.020

53

-

$9.530

$8.530

$8.020

Verical

USA . 53 parts In-Stock

1+ parts

-

100+ parts

$11.912

1k+ parts

$10.662

10k+ parts

$10.025

53

-

$11.912

$10.662

$10.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,167 parts In-Stock

1+ parts

$10.089

100+ parts

-

1k+ parts

-

10k+ parts

-

2,167

$10.089

-

-

-

Vyrian

USA . 7,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,040

-

-

-

-

Anansix

USA . 1,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 53 parts In-Stock

1+ parts

$9.030

100+ parts

-

1k+ parts

-

10k+ parts

-

53

$9.030

-

-

-

Corphita

USA . 2,678 parts In-Stock

1+ parts

$9.558

100+ parts

-

1k+ parts

-

10k+ parts

-

2,678

$9.558

-

-

-

AZTECH Wire

Italy . 109 parts In-Stock

1+ parts

$15.540

100+ parts

-

1k+ parts

-

10k+ parts

-

109

$15.540

-

-

-

Microchip USA

USA . 259 parts In-Stock

1+ parts

$28.532

100+ parts

-

1k+ parts

-

10k+ parts

-

259

$28.532

-

-

-

UNI Independent Distributors

Spain . 7,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,417

-

-

-

-

Overview

Elevate your audio experience with the TDF8544J/N2,112 from NXP Semiconductors. Renowned for their innovation and quality, NXP delivers a powerful audio amplifier that ensures crystal-clear sound across various applications. With robust performance in extreme temperatures and energy-efficient design, this versatile solution enhances everything from consumer electronics to industrial systems, providing exceptional value and reliability you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body enhances durability and reduces weight, making the amplifier suitable for diverse applications.

No. of Functions: 4

With four functions, this amplifier provides versatility, allowing users to maximize their audio setups without needing multiple devices.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into various designs and configurations, ensuring compatibility with standard layouts.

General IC Type: AUDIO AMPLIFIER

As a dedicated audio amplifier, it provides optimized performance for audio signals, ensuring high-quality sound reproduction.

Power Supplies (V): 14.4

Operating at 14.4V makes this product compatible with a wide range of power systems, offering flexibility in power supply options.

No. of Terminals: 16

Having 16 terminals allows for comprehensive connectivity options, enabling easier integration with other components in the audio system.

Package Style (Meter): IN-LINE

The in-line package style supports compact design layouts, making it ideal for space-constrained applications.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliable performance even in high-temperature environments, contributing to longevity.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this amplifier is suitable for extreme environments, ensuring consistent operation in various conditions.

Terminal Position: ZIG-ZAG

The zig-zag terminal position aids in circuit board layout flexibility, assisting in optimizing space and simplifying manufacturing.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this amplifier is built to withstand challenging conditions, making it a reliable choice for professional applications.

Technology: BCDMOS

Utilizing BCDMOS technology enhances power efficiency and performance, ensuring the amplifier operates effectively while consuming minimal energy.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and ease of soldering, which is particularly beneficial for prototyping and DIY projects.

Maximum Supply Current: 350 mA

The 350 mA maximum supply current allows for the amplification of substantial audio signals, providing powerful output without distortion.

Terminal Pitch: 1 mm

A terminal pitch of 1 mm facilitates efficient layout planning on circuit boards, promoting effective design and assembly processes.

Technical Specifications

Audio & Video Amplifiers TDF8544J/N2,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T27

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP27,.16,.16,40

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

350 mA

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDF8544J/N2,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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