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SAA4955TJDP

NXP Semiconductors

SAA4955TJDP by NXP Semiconductors

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: SOJ; Package Shape: RECTANGULAR; Technology: CMOS;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,270 parts In-Stock

1+ parts

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1k+ parts

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4,270

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Vyrian

USA . 3,142 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,142

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Anansix

USA . 1,870 parts In-Stock

1+ parts

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100+ parts

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1,870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,023 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

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10k+ parts

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1,023

$20.000

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Corphita

USA . 4,865 parts In-Stock

1+ parts

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100+ parts

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4,865

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UNI Independent Distributors

Spain . 2,991 parts In-Stock

1+ parts

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100+ parts

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2,991

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Technical Specifications

Other Function Memory ICs SAA4955TJDP attributes and parameters. Explore more Other Function Memory ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-J40

Memory Density:

2949264 bit

Memory IC Type:

Memory Width:

12

No. of Functions:

1

No. of Terminals:

40

No. of Words:

245772 words

No. of Words Code:

245772

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

245772X12

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Position:

DUAL

Trade Compliance

SAA4955TJDP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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