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PMN25EN

NXP Semiconductors

PMN25EN by NXP Semiconductors

PMN25EN from NXP Semiconductors is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 6.2 A, a breakdown voltage of 30 V, and low on-resistance of 0.023 Ω. Ideal for compact electronic designs with surface mount capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,462 parts In-Stock

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Digiode

USA . 2,841 parts In-Stock

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Anansix

USA . 885 parts In-Stock

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AZTECH Wire

Italy . 10,987 parts In-Stock

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$6.710

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One Stop Electronics

USA . 1,159 parts In-Stock

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$43.050

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Kepictronics

USA . 306,000 parts In-Stock

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UNI Independent Distributors

Spain . 6,390 parts In-Stock

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Corphita

USA . 2,704 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Supply Digital

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Overview

Elevate your designs with the PMN25EN from NXP Semiconductors, a premium N-channel small signal FET that combines reliability and efficiency. This versatile component excels in switching applications, offering exceptional performance in a compact footprint. With NXP's renowned quality and innovation backing it, enjoy peace of mind as you enhance your products' functionality while maximizing energy savings. Transform your projects with the power of precision!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers a lightweight and durable housing, making the FET ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for efficient switching and amplification, providing better performance in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against back EMF, simplifying circuit design and ensuring reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast response times, making it suitable for high-speed circuits.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on PCBs, making it user-friendly for modern electronics.

Minimum DS Breakdown Voltage: 30 V

The 30 V breakdown voltage ensures the FET can handle reasonable voltage levels without damage, improving its robustness.

Package Shape: RECTANGULAR

The rectangular shape provides ease of integration onto PCBs, helping to optimize layout design and space.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and provide superior mechanical stability, enhancing assembly efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures low off-state current, ensuring greater efficiency and lower power consumption in devices.

No. of Terminals: 6

Six terminals offer versatility in circuit design, accommodating various configurations and facilitating easier testing and prototyping.

Package Style (Meter): SMALL OUTLINE

Small outline packages are ideal for space-constrained applications, adding flexibility for use in compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low power loss, making the FET suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon-based transistors provide excellent thermal performance and reliability, making them a trusted choice in electronic design.

Terminal Finish: PURE TIN

Pure tin finishing improves solderability and prevents oxidation, ensuring reliable connections and long-term performance.

Maximum Drain Current (ID): 6.2 A

With a maximum drain current of 6.2 A, this FET can handle substantial loads, making it ideal for applications requiring higher current.

Maximum Drain-Source On Resistance: 0.023 ohm

A low on-resistance translates to lower power dissipation and improved efficiency in switching applications.

Terminal Position: DUAL

Dual terminal positioning provides better layout flexibility, enhancing the ease of integration onto circuit boards.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMN25EN attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

6.2 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMN25EN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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