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PMN22XN,115

NXP Semiconductors

PMN22XN,115 by NXP Semiconductors

PMN22XN,115 by NXP Semiconductors is an N-channel FET designed for efficient switching applications. It features a max drain current of 5.7 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact electronic designs with its surface mount capability.

Median Price

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Lifecycle Status

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3

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1k+

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Digiode

USA . 4,265 parts In-Stock

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Anansix

USA . 1,971 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 10,137 parts In-Stock

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One Stop Electronics

USA . 1,023 parts In-Stock

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Kepictronics

USA . 11,800 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 3,843 parts In-Stock

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Supply Digital

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A-Z Elektronik GmbH

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Overview

Unlock unparalleled efficiency with the PMN22XN,115 from NXP Semiconductors, a leader in innovation and reliability. This N-channel FET is designed for seamless switching applications, delivering robust performance in compact systems. Crafted from high-quality materials, it ensures longevity and dependable operation even under demanding conditions. Choose the PMN22XN,115 to enhance your projects with superior power management and streamlined designs, elevating your technology to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and thermal resistance, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher electron mobility, leading to better performance and efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection against reverse voltage, enhancing reliability in circuits.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle fast switching speeds and high efficiency.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient automated assembly, reducing production costs.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures the device can safely operate in a wide range of voltage conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for space-efficient PC board layouts, optimizing design flexibility.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and handling, ensuring a secure connection on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation results in low leakage current when the device is off, improving overall efficiency.

Maximum Drain Current (Abs) (ID): 5.7 A

With a maximum drain current of 5.7A, this FET can handle significant loads, making it versatile in applications.

No. of Terminals: 6

The six-terminal configuration allows for versatile connectivity, adding flexibility in circuit design.

Maximum Power Dissipation (Abs): 6.25 W

A maximum power dissipation of 6.25W ensures it can manage heat effectively under high power conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style is suitable for compact devices, conserving space in electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high switching speeds and low on-resistance, translating to improved efficiency.

Maximum Operating Temperature: 150 °C

With a high operating temperature, this FET can perform reliably in demanding environments.

Transistor Element Material: SILICON

Silicon material ensures good conductivity and thermal stability, contributing to overall performance.

Terminal Finish: TIN

Tin plating enhances solderability and corrosion resistance, ensuring long-lasting connections.

Maximum Drain Current (ID): 5.7 A

Reiterating the current capacity emphasizes its robustness and suitability for heavy-load applications.

Maximum Drain-Source On Resistance: 0.027 ohm

Low on-resistance reduces power loss during operation, contributing to overall system efficiency.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design, allowing for versatile circuit configurations.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard soldering processes, facilitating easier manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature capability allows for reliable soldering and compatibility with modern assembly techniques.

Reference Standard: IEC-60134

Compliance with IEC-60134 ensures the product meets international standards for reliability and performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMN22XN,115 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

5.7 A

Maximum Drain Current (ID):

5.7 A

Maximum Drain-Source On Resistance:

.027 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

IEC-60134

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMN22XN,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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