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PCF8570P

NXP Semiconductors

PCF8570P by NXP Semiconductors

STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;

Median Price

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Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

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Vyrian

USA . 3,789 parts In-Stock

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Digiode

USA . 2,725 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,250 parts In-Stock

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ComSIT USA

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Anansix

USA . 923 parts In-Stock

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Sinequanon

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LIBRA Elektronik GmbH

Germany . 574 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

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Pegasus Components GmbH

Germany . 299 parts In-Stock

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ABC Electronics Ltd.

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Zilex Electronics Inc.

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ACDS - Activité Composants Distribution Service

France . 122 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 100 parts In-Stock

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Sogenti Electronics

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Semi Source

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Corel Iberica Componentes, S.L.

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J2 Sourcing AB

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Resion

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PC Components Company LLC

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Ashlea Components Ltd

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GES GmbH

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LittleDiode

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One Stop Electronics

USA . 1,160 parts In-Stock

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Perfect Parts

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Assy Fe

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Cyclops Electronics Ltd (Excess)

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UNI Independent Distributors

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Corphita

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Kepictronics

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Technical Specifications

SRAM PCF8570P attributes and parameters. Explore more SRAM devices from NXP Semiconductors

Specs

Additional Features:

2-WIRE I2C SERIAL INTERFACE

Maximum Clock Frequency (fCLK):

.1 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.5 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Standby Current:

.0000004 Amp

Minimum Standby Voltage:

1 V

Sub-Category:

SRAMs

Maximum Supply Current:

.2 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

PCF8570P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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