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PCF85116-3P/01,112

NXP Semiconductors

PCF85116-3P/01,112 by NXP Semiconductors

EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 2KX8;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,455 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,455

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Digiode

USA . 1,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,013

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Anansix

USA . 869 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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869

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,160 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,160

$7.000

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Microchip USA

USA . 354 parts In-Stock

1+ parts

$17.944

100+ parts

-

1k+ parts

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10k+ parts

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354

$17.944

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AZTECH Wire

Italy . 41 parts In-Stock

1+ parts

$20.650

100+ parts

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1k+ parts

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41

$20.650

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UNI Independent Distributors

Spain . 5,837 parts In-Stock

1+ parts

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100+ parts

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5,837

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Corphita

USA . 4,795 parts In-Stock

1+ parts

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4,795

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Technical Specifications

EEPROM PCF85116-3P/01,112 attributes and parameters. Explore more EEPROM devices from NXP Semiconductors

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

20

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010MMMR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.5 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Serial Bus Type:

I2C

Sub-Category:

EEPROMs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE

Trade Compliance

PCF85116-3P/01,112 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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