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PCA82C250T/N,115

NXP Semiconductors

PCA82C250T/N,115 by NXP Semiconductors

PCA82C250T/N,115 by NXP Semiconductors is a Network Interface IC with 8 terminals and 5V supply voltage. It operates in automotive temperature range (-40 to 125°C) and consumes max. 0.07mA current. Ideal for interface circuits in automotive applications due to its small outline package and gull wing terminal form.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Nova Conductors

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Microchip USA

USA . 173 parts In-Stock

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AZTECH Wire

Italy . 511 parts In-Stock

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Corohmni

South Africa . 240 parts In-Stock

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Aztec Data Supply Inc.

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Ampacity Inc.

Singapore . 715 parts In-Stock

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Semicontronic

India . 859 parts In-Stock

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$119.925

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One Stop Electronics

USA . 1,069 parts In-Stock

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Continental Prestige Electronics

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Lucentia Tech

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Bastille Electronics

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Overview

Upgrade your network interfaces with the high-quality PCA82C250T/N,115 by NXP Semiconductors. Designed for automotive applications, this small outline package delivers reliable performance and seamless connectivity. With a nominal supply voltage of 5V and a maximum operating temperature of 125°C, this interface circuit is the perfect choice for your next project. Trust NXP Semiconductors to provide top-of-the-line technology and unmatched value for all your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and resistance to damage, making this product long-lasting.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient for users, especially in compact spaces.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with most devices, making integration seamless.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, expanding the product's compatibility with various systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand heat-intensive environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable functionality even in extremely cold conditions.

Technical Specifications

Network Interfaces PCA82C250T/N,115 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.07 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

PCA82C250T/N,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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