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P5010NSN1QMB

NXP Semiconductors

P5010NSN1QMB by NXP Semiconductors

NXP Semiconductors P5010NSN1QMB microprocessor features 64-bit external data bus, 166 MHz clock frequency, and integrated cache. Ideal for low power applications in grid array package with 1295 terminals.

Median Price

$435.709

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

P5010NSN1QMB by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

$354.150

100+ parts

$332.900

1k+ parts

$311.650

10k+ parts

-

15

$354.150

$332.900

$311.650

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DigiKey

USA . 9 parts In-Stock

1+ parts

$428.730

100+ parts

-

1k+ parts

-

10k+ parts

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9

$428.730

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-

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Verical

USA . 15 parts In-Stock

1+ parts

$442.688

100+ parts

$416.125

1k+ parts

$389.563

10k+ parts

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15

$442.688

$416.125

$389.563

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Farnell

UK . 15 parts In-Stock

1+ parts

$457.208

100+ parts

-

1k+ parts

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15

$457.208

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,085 parts In-Stock

1+ parts

$243.067

100+ parts

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1k+ parts

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3,085

$243.067

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Vyrian

USA . 7,493 parts In-Stock

1+ parts

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7,493

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Anansix

USA . 431 parts In-Stock

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431

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 10 parts In-Stock

1+ parts

$217.480

100+ parts

-

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10

$217.480

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Corphita

USA . 1,919 parts In-Stock

1+ parts

$230.274

100+ parts

-

1k+ parts

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1,919

$230.274

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Microchip USA

USA . 1,478 parts In-Stock

1+ parts

$391.760

100+ parts

$381.320

1k+ parts

$376.090

10k+ parts

$370.870

1,478

$391.760

$381.320

$376.090

$370.870

Vigor

Singapore . 424 parts In-Stock

1+ parts

$395.720

100+ parts

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424

$395.720

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Component Stockers USA

USA . 43 parts In-Stock

1+ parts

$412.730

100+ parts

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43

$412.730

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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UNI Independent Distributors

Spain . 803 parts In-Stock

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803

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Overview

Experience unparalleled performance and reliability with the P5010NSN1QMB microprocessor by NXP Semiconductors. Crafted with precision and cutting-edge technology, this processor is designed to elevate your applications to new heights. With integrated cache, high clock frequency, and low power mode, this product offers seamless operation and efficiency. Whether you're in the automotive, industrial, or consumer electronics industry, the P5010NSN1QMB delivers exceptional value and performance for all your computing needs. Trust NXP Semiconductors to bring you quality and innovation that surpasses expectations. Elevate your projects with the P5010NSN1QMB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Integrated Cache: YES

Having an integrated cache improves the processor's performance by reducing the time it takes to access frequently used data.

Maximum Supply Voltage: 1.15 V

The higher maximum supply voltage allows for better performance without risking damage to the processor.

Address Bus Width: 16

A wider address bus allows for more efficient communication between the processor and other components, improving overall system speed.

Package Shape: SQUARE

The square shape of the package makes it easy to mount securely and efficiently in a variety of systems.

No. of Terminals: 1295

The large number of terminals allows for a high level of connectivity and versatility in system integration.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The package style with a heat sink/slugh allows for efficient heat dissipation, preventing the processor from overheating during operation.

Minimum Supply Voltage: 1.05 V

The lower minimum supply voltage helps in reducing power consumption and increasing energy efficiency of the processor.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity of the processor.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to mount and connect the processor in a compact system design.

Maximum Seated Height: 3.53 mm

The low seated height allows for slim and compact system designs that require minimal space for the processor.

Width: 37.5 mm

The moderate width of the processor makes it suitable for various system configurations without compromising on performance.

Boundary Scan: YES

Having boundary scan capability allows for easier testing and debugging of the processor during development and maintenance.

External Data Bus Width: 64

A wider external data bus allows for faster data transfer between the processor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 166 MHz

The high maximum clock frequency enables high-speed processing of instructions, improving the performance of the processor in demanding tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures that the processor remains stable and reliable during the assembly process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance makes the processor suitable for lead-free assembly processes that require higher temperature settings.

Length: 37.5 mm

The moderate length of the processor allows for flexibility in system integration while maintaining a compact overall design.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers simplified instructions and efficient processing, making it ideal for high-performance computing applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the processor energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides reliable connections and allows for easy mounting and soldering of the processor in various system configurations.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage offers a balance between performance and power consumption, ensuring optimal efficiency of the processor.

Terminal Pitch: 1 mm

The small terminal pitch allows for a high-density layout of terminals, enabling compact system designs and efficient signal routing.

Format: FIXED POINT

Having a fixed-point format simplifies arithmetic operations and enhances computational efficiency in applications that do not require floating-point precision.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the processor is robust against moisture exposure during storage and handling, ensuring long-term reliability.

Speed: 1600 rpm

The speed of 1600 rpm ensures efficient operation of the processor in high-performance computing tasks and demanding applications.

Low Power Mode: YES

The low power mode feature allows the processor to operate efficiently at reduced power levels to save energy and extend battery life in portable devices.

Technical Specifications

Microprocessors P5010NSN1QMB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

166 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1295

JESD-609 Code:

e1

Length:

37.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.53 mm

Speed:

1600 rpm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

P5010NSN1QMB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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