Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NXP Semiconductors P5010NSN1QMB microprocessor features 64-bit external data bus, 166 MHz clock frequency, and integrated cache. Ideal for low power applications in grid array package with 1295 terminals.
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$428.730
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$442.688
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$457.208
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$243.067
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This material is durable and cost-effective, making the product reliable and affordable.
Having an integrated cache improves the processor's performance by reducing the time it takes to access frequently used data.
The higher maximum supply voltage allows for better performance without risking damage to the processor.
A wider address bus allows for more efficient communication between the processor and other components, improving overall system speed.
The square shape of the package makes it easy to mount securely and efficiently in a variety of systems.
The large number of terminals allows for a high level of connectivity and versatility in system integration.
The package style with a heat sink/slugh allows for efficient heat dissipation, preventing the processor from overheating during operation.
The lower minimum supply voltage helps in reducing power consumption and increasing energy efficiency of the processor.
This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity of the processor.
The bottom terminal position makes it easier to mount and connect the processor in a compact system design.
The low seated height allows for slim and compact system designs that require minimal space for the processor.
The moderate width of the processor makes it suitable for various system configurations without compromising on performance.
Having boundary scan capability allows for easier testing and debugging of the processor during development and maintenance.
A wider external data bus allows for faster data transfer between the processor and external devices, enhancing overall system performance.
The high maximum clock frequency enables high-speed processing of instructions, improving the performance of the processor in demanding tasks.
The short time at peak reflow temperature ensures that the processor remains stable and reliable during the assembly process.
The high peak reflow temperature tolerance makes the processor suitable for lead-free assembly processes that require higher temperature settings.
The moderate length of the processor allows for flexibility in system integration while maintaining a compact overall design.
Being a RISC microprocessor, it offers simplified instructions and efficient processing, making it ideal for high-performance computing applications.
CMOS technology offers low power consumption and high noise immunity, making the processor energy-efficient and reliable.
The ball terminal form provides reliable connections and allows for easy mounting and soldering of the processor in various system configurations.
The nominal supply voltage offers a balance between performance and power consumption, ensuring optimal efficiency of the processor.
The small terminal pitch allows for a high-density layout of terminals, enabling compact system designs and efficient signal routing.
Having a fixed-point format simplifies arithmetic operations and enhances computational efficiency in applications that do not require floating-point precision.
The MSL 3 rating indicates that the processor is robust against moisture exposure during storage and handling, ensuring long-term reliability.
The speed of 1600 rpm ensures efficient operation of the processor in high-performance computing tasks and demanding applications.
The low power mode feature allows the processor to operate efficiently at reduced power levels to save energy and extend battery life in portable devices.
Microprocessors P5010NSN1QMB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P5010NSN1QMB Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
SMBJ18CA
Diodes Incorporated
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM2931AZ-5.0G
Onsemi
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
ABS25-32.768KHZ-1-T
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
NC7WZ17P6X
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
BSS138W-7-F
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SN278792960
SN278792960 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It features integrated cache, operates at a max clock frequency of 26 MHz, and has 64 DMA channels. Ideal for applications requiring low power consumption and fixed-point processing in various electronic devices.
AM3517AZCNA
AM3517AZCNA by Texas Instruments is a Microprocessor with 16-bit Address Bus, 8-bit On Chip Data RAM Width, and 65536 RAM Words. It operates at a max clock frequency of 26 MHz and has low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing in compact devices.
P1010NSE5HHA
Freescale Semiconductor
MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: BGA425,23X23,32; Peak Reflow Temperature (C): 260; Surface Mount: YES;
AM3356BZCZ80
AM3356BZCZ80 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications. With 64 DMA channels, it is ideal for use in devices requiring high-speed data processing and boundary scan capabilities.
AM3517AZERA
AM3517AZERA by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and 26 MHz max clock frequency. Ideal for industrial applications requiring high-speed processing in a compact package.
MC9328MXLVH15
Motorola
MC9328MXLVH15 by Motorola is a 32-bit microprocessor with integrated cache and 25-bit address bus width. It operates at a max clock frequency of 16 MHz, suitable for low power applications in commercial temperature grade environments. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.
MPC8245LVV266D
NXP Semiconductors
NXP Semiconductors' MPC8245LVV266D is a 32-bit microprocessor with integrated cache and low power mode. It operates at a max clock frequency of 66 MHz, suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems. The processor features a CMOS technology, with a terminal pitch of 1.27 mm and a package style of grid array, making it ideal for compact designs.
STM32MP157CAB3
STMicroelectronics
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
AM3352BZCZ80
AM3352BZCZ80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 26 MHz clock frequency, and 64 DMA channels. It is used in applications requiring low power mode, such as embedded systems and IoT devices.
T4081NSE7TTB
The NXP Semiconductors T4081NSE7TTB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 133.3 MHz. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.
STM32MP151CAC3
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
LS1012AXN7KKB
LS1012AXN7KKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit address and data bus width, operating at up to 25 MHz. Ideal for industrial applications, it features low power mode, integrated cache, and boundary scan support for efficient performance in compact designs.
MPC860TVR66D4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA357,19X19,50;
MC7448THX1400ND
The NXP Semiconductors MC7448THX1400ND microprocessor features a 32-bit architecture, 64-bit external data bus width, and operates at a max clock frequency of 200 MHz. Ideal for industrial applications requiring high-speed processing with low power consumption.
LS1012AXE7KKB
LS1012AXE7KKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit external data bus width, operating at a max clock frequency of 25 MHz. Ideal for industrial applications, it features low power mode and integrated cache, making it suitable for high-speed processing in compact devices.
OMAP3530ECBBA
OMAP3530ECBBA by Texas Instruments is a MICROPROCESSOR with RISC technology, operating at 720 rpm. It features a GRID ARRAY package style with 515 terminals and operates in an INDUSTRIAL temperature grade range of -40 to 105 °C. This processor is suitable for applications requiring high-speed processing in harsh environments.
MPC8313VRAFFB
The Freescale Semiconductor MPC8313VRAFFB is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and heat sink/slug, this processor offers versatile performance in various industrial and embedded systems.
STM32MP157DAA1
STM32MP157DAA1 by STMicroelectronics is a 32-bit microprocessor with 64 MHz clock frequency, 448 terminals, and 724992 RAM words. Ideal for industrial applications, it features low power mode, boundary scan support, and 48 DMA channels for efficient data transfer.
P2010NXN2KFC
The NXP Semiconductors P2010NXN2KFC microprocessor features a 64-bit external data bus width, 16-bit address bus width, and operates at a max clock frequency of 100 MHz. It is commonly used in applications requiring low power consumption and high processing speeds, such as embedded systems and IoT devices.
MIMXRT1165XVM5A
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
P5010NSN7QMB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Maximum Clock Frequency: 166 MHz;
P5010NSE7VNB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;
P5010NSE1TNB,557
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.53 mm;
P5010NSN1VNB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Width: 37.5 mm;
P5010NSE7QMB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
P5010NSN7TNB
P5010NSE1QMB
P5010NSN1MMB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;
P5010NSE1VNB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; External Data Bus Width: 64;
P5010NSN1TNB,557
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Length: 37.5 mm;
P5010NSN1QMB,557
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Width: 37.5 mm;
P5010NSE7MMB,557
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;
P5010NSN7MMB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Length: 37.5 mm;
P5010NSE1TNB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
P5010NSE7TNB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
P5010NSE1MMB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;
P5010NSE1QMB,557
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
P5010NSE7MMB
P5010NSN1TNB
Supply Digital Components
$106.00
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Quantity
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