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NX3L2G384GD,125

NXP Semiconductors

NX3L2G384GD,125 by NXP Semiconductors

NX3L2G384GD,125 from NXP Semiconductors is a dual-function CMOS multiplexer designed for automotive applications. It operates at 1.5/3.3V with a max on-state resistance of 4.1Ω and supports temperatures from -40 °C to 125 °C. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

$0.404

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 965 parts In-Stock

1+ parts

-

100+ parts

$0.396

1k+ parts

$0.329

10k+ parts

$0.293

965

-

$0.396

$0.329

$0.293

Verical

USA . 965 parts In-Stock

1+ parts

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$0.411

10k+ parts

$0.367

965

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-

$0.411

$0.367

Distributors (In-Stock)

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Digiode

USA . 940 parts In-Stock

1+ parts

$0.309

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940

$0.309

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Vyrian

USA . 7,205 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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Anansix

USA . 2,077 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,181 parts In-Stock

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$0.292

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$0.292

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Vigor

Singapore . 543 parts In-Stock

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$0.310

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543

$0.310

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Microchip USA

USA . 9,099 parts In-Stock

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$0.538

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$0.538

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AZTECH Wire

Italy . 320 parts In-Stock

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$18.460

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$18.460

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Perfect Parts

USA . 6,802 parts In-Stock

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UNI Independent Distributors

Spain . 6,560 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,000 parts In-Stock

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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Overview

Elevate your designs with the NX3L2G384GD from NXP Semiconductors—where quality meets innovation. This versatile multiplexer is engineered for superior performance in demanding automotive applications, delivering reliability and efficiency under extreme conditions. With its compact design and outstanding temperature resilience, it ensures seamless integration into your projects, providing exceptional value and enhancing your product's capabilities. Trust in NXP’s legacy of excellence to power your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring long-lasting performance in various applications.

Surface Mount: YES

Facilitates compact designs and allows for automated assembly processes, making it suitable for modern electronic devices.

No. of Functions: 2

Allows for versatile applications, enabling users to save space and reduce component count in their designs.

Package Shape: RECTANGULAR

Optimizes PCB layout and provides ease of placement, which is advantageous during circuit design.

Power Supplies (V): 1.5/3.3

Compatible with a range of power supplies, making it flexible for different circuit requirements.

No. of Terminals: 8

Provides sufficient connection points for robust functionality while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

Allows for high-density PCB layouts, essential for space-constrained electronic devices.

Maximum Operating Temperature: 125 °C

Ensures reliable operation in high-temperature environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Guarantees performance in extreme cold conditions, enhancing its reliability in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent corrosion resistance and reliable electrical performance, improving overall device longevity.

Terminal Position: DUAL

Facilitates easy integration into complex circuits, promoting efficient design and assembly.

Output (V): SEPARATE OUTPUT

Provides flexibility in design and enables easier integration into a variety of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures compatibility with standard reflow soldering processes, aiding in efficient manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during soldering, ensuring reliable attachment to PCBs.

Maximum On-state Resistance (Ron): 4.1 ohm

Low resistance improves efficiency by minimizing power loss when the switch is in the on state.

Maximum Switch-on Time: 41 ns

Allows for fast switching, making it suitable for high-speed applications and reducing overall latency.

Temperature Grade: AUTOMOTIVE

Designed for the rigors of automotive applications, ensuring durability and reliability under harsh conditions.

Technology: CMOS

Provides low power consumption and high integration levels, ideal for battery-operated devices.

Terminal Form: NO LEAD

Improves environmental performance and allows for better surface mounting, enhancing PCB design.

Terminal Pitch: 0.5 mm

Allows for high-density layouts, making it suitable for compact and portable electronic devices.

Normal Position (V): NC

Provides flexibility in controlling signal paths, improving overall circuit design capabilities.

Technical Specifications

Multiplexers & Switches NX3L2G384GD,125 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NC

No. of Functions:

2

No. of Terminals:

8

Maximum On-state Resistance (Ron):

4.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

41 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX3L2G384GD,125 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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