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NX3L1G3157GW

NXP Semiconductors

NX3L1G3157GW by NXP Semiconductors

NX3L1G3157GW by NXP Semiconductors is a SPDT switch with 6 terminals, operating at -40 to 125°C. It has a max on-state resistance of 1.7 ohm and switching voltage of 4.3V, suitable for automotive applications due to its CMOS technology and high isolation of 90 dB.

Median Price

$0.140

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

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$0.140

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$0.140

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$0.130

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Chip Stock

USA . 146,000 parts In-Stock

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Digiode

USA . 2,487 parts In-Stock

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Anansix

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ACDS - Activité Composants Distribution Service

France . 1,652 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 300 parts In-Stock

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One Stop Electronics

USA . 252 parts In-Stock

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$2.500

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Ampacity Inc.

Singapore . 1,629 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,169 parts In-Stock

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$3.889

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Microchip USA

USA . 1,206 parts In-Stock

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Corohmni

South Africa . 229 parts In-Stock

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AZTECH Wire

Italy . 432 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,132 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Corphita

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Glotronic Ltd.

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Lixinc

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Continental Prestige Electronics

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Argo Parts USA

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UNI Independent Distributors

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Overview

Unlock the possibilities with the NX3L1G3157GW by NXP Semiconductors, a high-quality multiplexer that offers seamless switching capabilities in a compact package. Manufactured by industry leader NXP Semiconductors, this versatile component is ideal for a wide range of applications in automotive and beyond. With its advanced technology and reliable performance, the NX3L1G3157GW provides customers with unmatched value, efficiency, and precision. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer, ensuring long-lasting performance.

Surface Mount: YES

Ease of installation and compatibility with modern PCB assembly processes.

Nominal Supply Voltage (Vsup): 1.65 V

Efficient power usage and compatibility with low voltage systems.

Maximum Operating Temperature: 125 °C

Ability to operate in high-temperature environments, suitable for a wide range of applications.

Technology: CMOS

Uses CMOS technology for low power consumption and high speed operation.

Technical Specifications

Multiplexers & Switches NX3L1G3157GW attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

90 dB

Nominal On-state Resistance Match:

.2 ohm

Maximum On-state Resistance (Ron):

1.7 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

52 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

NX3L1G3157GW Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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