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NX3L4357GM,132

NXP Semiconductors

NX3L4357GM,132 by NXP Semiconductors

NXP Semiconductors' NX3L4357GM,132 is a SP3T CMOS switch with 10 terminals and on-state resistance of 4.1 ohm. It operates b/w -40 to 125 °C and has separate output at 1.4/4.3V, making it ideal for automotive applications requiring fast switching times of 125 ns.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,685 parts In-Stock

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Digiode

USA . 3,988 parts In-Stock

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Anansix

USA . 1,079 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Microchip USA

USA . 426 parts In-Stock

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$0.381

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One Stop Electronics

USA . 1,615 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 654 parts In-Stock

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UNI Independent Distributors

Spain . 7,541 parts In-Stock

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Corphita

USA . 2,200 parts In-Stock

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Argo Parts USA

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Aranea Global

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Continental Prestige Electronics

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Overview

Elevate your electronic designs with the NX3L4357GM,132 by NXP Semiconductors. This multiplexer & switch offers unmatched quality and reliability from a reputable manufacturer. Perfect for a variety of applications, this chip carrier package delivers separate outputs with minimal on-state resistance. With a wide temperature range and automotive-grade technology, this versatile component ensures peak performance in any environment. Trust NXP Semiconductors to provide innovative solutions that exceed expectations. Experience the value and benefits this SP3T switch brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and providing efficient utilization of the board.

Power Supplies (V): 1.4/4.3

Supports a wide range of power supplies, offering flexibility in different applications.

No. of Terminals: 10

Sufficient number of terminals for connecting multiple inputs and outputs, enabling versatile functionality.

Maximum Operating Temperature: 125 °C

Operates effectively in high-temperature environments, suitable for demanding industrial or automotive applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, making it energy-efficient and cost-effective.

Technical Specifications

Multiplexers & Switches NX3L4357GM,132 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N10

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum On-state Resistance (Ron):

4.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC10,.06X.08,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

125 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX3L4357GM,132 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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