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MW7IC2220NBR1

NXP Semiconductors

MW7IC2220NBR1 by NXP Semiconductors

NARROW BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: MOS; Minimum Operating Frequency: 2000 MHz; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 150 Cel;

Median Price

$36.710

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MW7IC2220NBR1 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 479 parts In-Stock

1+ parts

-

100+ parts

$35.210

1k+ parts

$31.500

10k+ parts

$29.650

479

-

$35.210

$31.500

$29.650

DigiKey

USA . 479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

479

-

-

-

-

Verical

USA . 479 parts In-Stock

1+ parts

-

100+ parts

$44.013

1k+ parts

$39.375

10k+ parts

$37.063

479

-

$44.013

$39.375

$37.063

Farnell

UK . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$36.710

10k+ parts

-

2

-

-

$36.710

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,770 parts In-Stock

1+ parts

$36.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,770

$36.710

-

-

-

Digiode

USA . 3,591 parts In-Stock

1+ parts

$37.259

100+ parts

-

1k+ parts

-

10k+ parts

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3,591

$37.259

-

-

-

Anansix

USA . 2,208 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,208

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,084 parts In-Stock

1+ parts

$35.298

100+ parts

-

1k+ parts

-

10k+ parts

-

3,084

$35.298

-

-

-

Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,700

-

-

-

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UNI Independent Distributors

Spain . 2,177 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,177

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,964 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,964

-

-

-

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Futuretech Components

Singapore . 743 parts In-Stock

1+ parts

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743

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Kepictronics

USA . 250 parts In-Stock

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250

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Perfect Parts

USA . 22 parts In-Stock

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22

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Technical Specifications

RF & Microwave Amplifiers MW7IC2220NBR1 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

29 dB

Maximum Input Power (CW):

20 dBm

JESD-609 Code:

e3

No. of Functions:

1

Maximum Operating Frequency:

2200 MHz

Minimum Operating Frequency:

2000 MHz

Maximum Operating Temperature:

150 Cel

Package Body Material:

Package Equivalence Code:

FLNG,.8''H SPACE

Power Supplies (V):

28

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Amplifiers

Technology:

MOS

Terminal Finish:

Matte Tin (Sn)

Maximum Voltage Standing Wave Ratio:

5

Trade Compliance

MW7IC2220NBR1 RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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