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MRFX1K80GNR5

NXP Semiconductors

MRFX1K80GNR5 by NXP Semiconductors

RF Power Field-Effect Transistors; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$279.284

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 23 parts In-Stock

1+ parts

$225.199

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23

$225.199

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DigiKey

USA . 70 parts In-Stock

1+ parts

$333.370

100+ parts

$268.912

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70

$333.370

$268.912

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Flip Electronics (Authorized)

USA . 50 parts In-Stock

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50

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Distributors (In-Stock)

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Digiode

USA . 3,410 parts In-Stock

1+ parts

$177.128

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3,410

$177.128

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Vyrian

USA . 3,346 parts In-Stock

1+ parts

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3,346

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Anansix

USA . 1,280 parts In-Stock

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1,280

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Flip Electronics

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Continental Prestige Electronics

USA . 28 parts In-Stock

1+ parts

$133.960

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28

$133.960

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Corphita

USA . 2,875 parts In-Stock

1+ parts

$167.805

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2,875

$167.805

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QUARKTWIN TECHNOLOGY LTD

USA . 15,041 parts In-Stock

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15,041

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Microchip USA

USA . 4,132 parts In-Stock

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4,132

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UNI Independent Distributors

Spain . 3,628 parts In-Stock

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3,628

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Technical Specifications

RF Power Field Effect Transistors (FET) MRFX1K80GNR5 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MRFX1K80GNR5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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