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MRFX600H-88MHZ

NXP Semiconductors

MRFX600H-88MHZ by NXP Semiconductors

NXP Semiconductors' MRFX600H-88MHZ is a N-CHANNEL RF Power FET with 24.5 dB power gain, suitable for amplifier applications in the Ultra High Frequency Band. It features a min DS breakdown voltage of 179 V, operates in enhancement mode, and has a max operating temperature of 225°C.

Median Price

$2,205.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

1+ parts

$2,205.000

100+ parts

-

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1

$2,205.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,841 parts In-Stock

1+ parts

$1,282.500

100+ parts

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2,841

$1,282.500

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Vyrian

USA . 5,087 parts In-Stock

1+ parts

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5,087

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Anansix

USA . 1,846 parts In-Stock

1+ parts

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1,846

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,149 parts In-Stock

1+ parts

$1,215.000

100+ parts

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3,149

$1,215.000

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Component Stockers USA

USA . 5 parts In-Stock

1+ parts

$1,320.400

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5

$1,320.400

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UNI Independent Distributors

Spain . 5,825 parts In-Stock

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5,825

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Overview

Experience superior performance and reliability with the NXP Semiconductors MRFX600H-88MHZ RF Power Field Effect Transistor. This high-quality product offers unmatched power gain and operates in the ultra-high frequency band, making it perfect for amplifier applications. With a durable plastic/epoxy package and advanced metal-oxide semiconductor technology, this transistor ensures long-lasting functionality even in extreme temperatures. Trust NXP Semiconductors to deliver cutting-edge solutions for your RF power needs. Elevate your projects with the MRFX600H-88MHZ and experience unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, allowing the transistor to withstand various environmental conditions.

Minimum Power Gain (Gp): 24.5 dB

High power gain indicates efficient amplification of signals, making this transistor suitable for applications where signal amplification is crucial.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for high input impedance and easy control of the transistor, making it versatile for different circuit configurations.

Maximum Operating Temperature: 225 °C

With a high maximum operating temperature, this transistor can operate reliably even in high-temperature environments, ensuring consistent performance.

Technical Specifications

RF Power Field Effect Transistors (FET) MRFX600H-88MHZ attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

179 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1.1 pF

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Minimum Power Gain (Gp):

24.5 dB

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRFX600H-88MHZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

9030.90

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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