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MMBR5031LT1

NXP Semiconductors

MMBR5031LT1 by NXP Semiconductors

NXP Semiconductors' MMBR5031LT1 is a NPN RF BJT transistor with 3 terminals, operating in the ultra-high frequency band up to 1000 MHz. It has a max collector-emitter voltage of 10V and can handle a collector current of 0.02A. Ideal for amplifier applications, this transistor offers a small outline package style and Gull Wing terminal form for surface mount assembly.

Median Price

$1.000

Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 4,707 parts In-Stock

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Digiode

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Anansix

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Nova Conductors

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One Stop Electronics

USA . 1,179 parts In-Stock

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Ampacity Inc.

Singapore . 503 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Assy Fe

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Argo Parts USA

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Overview

Unlock the power of cutting-edge technology with the NXP Semiconductors MMBR5031LT1. This RF Small Signal Bipolar Junction Transistor (BJT) offers unparalleled quality and reliability, backed by the trusted name of NXP Semiconductors. Ideal for a variety of applications, including amplifiers, this transistor delivers ultra-high performance in a compact package. With a maximum power dissipation of 0.3 W and a nominal transition frequency of 1000 MHz, the MMBR5031LT1 provides exceptional value and benefits to customers looking for top-notch performance in their electronic designs. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: NPN

NPN polarity allows for easy integration in circuits and compatibility with other NPN transistors.

Configuration: SINGLE

Single configuration simplifies circuit design and makes the transistor easy to use for amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and reliability in such circuits.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape provides a standard form factor for easy mounting and integration in circuit designs.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ultra high frequency band support enables use in high-performance circuits and applications that require fast signal processing.

No. of Terminals: 3

3 terminals allow for easy connection and compatibility with standard circuit designs.

Maximum Power Dissipation Ambient: 0.3 W

High maximum power dissipation rating allows for reliable operation in various ambient conditions.

Minimum DC Current Gain (hFE): 25

Minimum DC current gain ensures consistent and predictable amplification of signals.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for use in various environments and applications.

Maximum Collector-Base Capacitance: 1.5 pF

Low collector-base capacitance minimizes signal distortion and interference, improving overall performance.

Maximum Collector-Emitter Voltage: 10 V

High collector-emitter voltage rating provides robustness and protection against voltage spikes in circuits.

Transistor Element Material: SILICON

Silicon transistor element material offers high performance and reliability, making the transistor suitable for a wide range of applications.

Maximum Collector Current (IC): 0.02 A

Maximum collector current rating ensures the transistor can handle the required current levels in amplifier circuits.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures reliable connections in circuit assemblies.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit layout and connections.

Nominal Transition Frequency (fT): 1000 MHz

High nominal transition frequency enables the transistor to switch quickly between on and off states, making it suitable for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBR5031LT1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.5 pF

Maximum Collector-Emitter Voltage:

10 V

Configuration:

Minimum DC Current Gain (hFE):

25

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

.3 W

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBR5031LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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