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MC13212R2

NXP Semiconductors

MC13212R2 by NXP Semiconductors

MC13212R2 by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 2-3.4 V. This IC is ideal for industrial applications due to its compact GRID ARRAY package and surface mount capability.

Median Price

$5.600

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 4,655 parts In-Stock

1+ parts

-

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4,655

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DigiKey

USA . 4,337 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$5.030

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4,337

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$5.030

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Flip Electronics (Authorized)

USA . 4,337 parts In-Stock

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4,337

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Rochester

USA . 2,275 parts In-Stock

1+ parts

-

100+ parts

$5.600

1k+ parts

$5.010

10k+ parts

$4.710

2,275

-

$5.600

$5.010

$4.710

Farnell

UK . 2,000 parts In-Stock

1+ parts

-

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$9.811

2,000

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$9.811

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,184 parts In-Stock

1+ parts

$5.928

100+ parts

-

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3,184

$5.928

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Vyrian

USA . 61 parts In-Stock

1+ parts

$6.240

100+ parts

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61

$6.240

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Flip Electronics

USA . 4,337 parts In-Stock

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4,337

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Anansix

USA . 2,490 parts In-Stock

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2,490

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ACDS - Activité Composants Distribution Service

France . 1,211 parts In-Stock

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1,211

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Bristol Electronics

USA . 1,211 parts In-Stock

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1,211

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Dan-Mar Components

USA . 1,211 parts In-Stock

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1,211

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,028 parts In-Stock

1+ parts

$5.300

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3,028

$5.300

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Corphita

USA . 4,900 parts In-Stock

1+ parts

$5.616

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4,900

$5.616

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Corohmni

South Africa . 2,555 parts In-Stock

1+ parts

$71.840

100+ parts

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2,555

$71.840

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QUARKTWIN TECHNOLOGY LTD

USA . 21,069 parts In-Stock

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21,069

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Microchip USA

USA . 10,160 parts In-Stock

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10,160

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UNI Independent Distributors

Spain . 7,474 parts In-Stock

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7,474

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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1,800

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Overview

Get ready to experience top-notch performance with the MC13212R2 by NXP Semiconductors. This cutting-edge microprocessor circuit offers unmatched quality and reliability, ensuring seamless operation in a variety of applications. From industrial automation to consumer electronics, this versatile IC delivers exceptional value and benefits to customers looking for efficient and innovative solutions. Trust NXP Semiconductors to provide you with the technology you need to stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and improving overall product reliability.

Maximum Supply Voltage: 3.4 V

The high maximum supply voltage capability provides flexibility in power requirements and allows for compatibility with a range of systems.

Package Shape: SQUARE

The square package shape helps in efficient use of board space and allows for easier alignment during assembly.

No. of Terminals: 71

Having a higher number of terminals allows for more connections and functionalities to be integrated into the product, increasing its versatility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch enables high-density packaging and improves electrical performance.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement ensures efficient power consumption and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows for reliable operation in extreme cold conditions, enhancing the product's durability.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easier soldering and assembly onto circuit boards, improving manufacturing efficiency.

Width: 9 mm

The compact width of the product allows for space-efficient integration into electronic devices and systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures that the product undergoes proper soldering without risk of damage.

Peak Reflow Temperature °C: 250

The high peak reflow temperature capability allows for reliable soldering in lead-free processes, ensuring strong and durable connections.

Length: 9 mm

The compact length of the product contributes to its overall small form factor, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in demanding industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The incorporation of a microprocessor circuit as a peripheral IC type enhances the product's processing capabilities and enables advanced functionalities.

Technology: CMOS

Using CMOS technology results in low power consumption, high noise immunity, and excellent signal integrity, making the product energy-efficient and reliable.

Terminal Form: BUTT

The butt terminal form ensures secure and stable connections, reducing the risk of signal loss or disconnections in electronic circuits.

Nominal Supply Voltage: 2.7 V

Having a specific nominal supply voltage simplifies power management and ensures proper functioning of the product within the specified voltage range.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density packaging and allows for intricate circuit designs, optimizing the product's performance and efficiency.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture during storage and handling, ensuring its reliability in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MC13212R2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B71

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

71

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.4 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

MC13212R2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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