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MC13211

NXP Semiconductors

MC13211 by NXP Semiconductors

MC13211 by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 2-3.4 V. Ideal for industrial applications, it features a GRID ARRAY package style and 71 terminals in a compact 9x9 mm square shape.

Median Price

$5.862

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 21,690 parts In-Stock

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-

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$6.180

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21,690

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$6.180

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Rochester

USA . 1,410 parts In-Stock

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-

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$4.690

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$4.200

10k+ parts

$3.950

1,410

-

$4.690

$4.200

$3.950

Verical

USA . 780 parts In-Stock

1+ parts

-

100+ parts

$5.862

1k+ parts

$5.250

10k+ parts

$4.938

780

-

$5.862

$5.250

$4.938

Flip Electronics (Authorized)

USA . 520 parts In-Stock

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520

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Distributors (In-Stock)

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Digiode

USA . 3,908 parts In-Stock

1+ parts

$4.826

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-

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3,908

$4.826

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Connector Distribution Corp

USA . 107,500 parts In-Stock

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107,500

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Right Parts Inc.

USA . 107,500 parts In-Stock

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107,500

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Vyrian

USA . 36,427 parts In-Stock

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Anansix

USA . 1,405 parts In-Stock

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Flip Electronics

USA . 520 parts In-Stock

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520

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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ComSIT USA

USA . 50 parts In-Stock

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Nova Conductors

Japan . 26 parts In-Stock

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J2 Sourcing AB

Sweden . 7 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 36,216 parts In-Stock

1+ parts

$4.320

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36,216

$4.320

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Corphita

USA . 2,918 parts In-Stock

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$4.572

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2,918

$4.572

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Continental Prestige Electronics

USA . 790 parts In-Stock

1+ parts

$5.080

100+ parts

$3.670

1k+ parts

$2.290

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790

$5.080

$3.670

$2.290

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One Stop Electronics

USA . 36,231 parts In-Stock

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$9.400

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36,231

$9.400

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Corohmni

South Africa . 3,241 parts In-Stock

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$41.763

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3,241

$41.763

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Aztec Data Supply Inc.

USA . 2,214 parts In-Stock

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$63.863

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2,214

$63.863

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,366 parts In-Stock

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Lixinc

USA . 7,973 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UNI Independent Distributors

Spain . 167 parts In-Stock

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Perfect Parts

USA . 112 parts In-Stock

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112

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Argo Parts USA

USA . 103 parts In-Stock

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103

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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50

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Overview

Revolutionize your electronic designs with the MC13211 by NXP Semiconductors, a cutting-edge microprocessor circuit that offers unrivaled performance and reliability. This sleek and compact device boasts a wide range of applications in various industries, from consumer electronics to industrial automation. With NXP's reputation for excellence in semiconductor manufacturing, you can trust that the MC13211 delivers the quality and innovation you need to stay ahead of the competition. Experience the value and benefits of this advanced technology, and unleash the full potential of your next project with the MC13211.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 3.4 V

Provides flexibility in power supply options.

Package Shape: SQUARE

Compact shape for efficient use of space on PCBs.

Minimum Supply Voltage: 2 V

Can operate efficiently at low power levels.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature requirements.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures for diverse application scenarios.

Terminal Finish: NICKEL GOLD

Provides good conductivity and corrosion resistance for long-lasting performance.

Width: 9 mm

Compact size for space-constrained PCB designs.

Peak Reflow Temperature °C: 250

Can withstand high-temperature reflow processes during manufacturing.

Temperature Grade: INDUSTRIAL

Designed for use in industrial settings with reliable performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MC13211 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B71

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

71

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.4 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

MC13211 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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