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LPC4323JET100E

NXP Semiconductors

LPC4323JET100E by NXP Semiconductors

NXP Semiconductors' LPC4323JET100E microcontroller features a 32-bit Cortex-M4 CPU, 24-bit address bus, and 32-bit external data bus. With DAC and ADC channels, it's ideal for industrial applications requiring a max clock frequency of 25 MHz. This thin-profile chip operates b/w -40 to 85°C with a supply voltage range of 2.2-3.6 V.

Median Price

$11.058

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Verical

USA . 9,880 parts In-Stock

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Flip Electronics (Authorized)

USA . 260 parts In-Stock

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Vyrian

USA . 4,190 parts In-Stock

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Digiode

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Anansix

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Nova Conductors

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Semicontronic

India . 260 parts In-Stock

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$2.000

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$1.950

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$1.940

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Vigor

Singapore . 3,304 parts In-Stock

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$16.027

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AZTECH Wire

Italy . 605 parts In-Stock

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Corohmni

South Africa . 471 parts In-Stock

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Continental Prestige Electronics

USA . 1,020 parts In-Stock

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Ampacity Inc.

Singapore . 121 parts In-Stock

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Advanced Electronics

New Zealand . 42 parts In-Stock

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Aztec Data Supply Inc.

USA . 654 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Corphita

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Argo Parts USA

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Australia . 100 parts In-Stock

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Overview

Unlock the power of innovation with the LPC4323JET100E by NXP Semiconductors. This cutting-edge microcontroller offers unparalleled performance and reliability, backed by the esteemed reputation of its manufacturer. Ideal for a wide range of applications, this product provides exceptional value to customers seeking advanced solutions for their projects. Experience seamless integration, superior efficiency, and endless possibilities with the LPC4323JET100E - the ultimate choice for your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable makes it easy to integrate the microcontroller onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltages, providing flexibility in power requirements.

Address Bus Width: 24

A large address bus width allows for efficient memory addressing and data transfer within the microcontroller.

Package Shape: SQUARE

Square package shape is compact and easy to handle, suitable for various applications.

Bit Size: 32

A 32-bit architecture offers high processing capabilities and precision in handling data and instructions.

DAC Channels: YES

Integrated DAC channels enable analog output functionality, useful for interfacing with sensors and actuators.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows compatibility with different voltage sources and applications.

No. of Terminals: 100

A high number of terminals provide ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch offers efficient board space utilization and ease of soldering.

Minimum Supply Voltage: 2.2 V

Low minimum supply voltage requirement ensures operation in low power scenarios, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable performance in a wide range of environmental conditions.

CPU Family: CORTEX-M4

Belonging to the Cortex-M4 family signifies advanced processing capabilities and features for efficient microcontroller operation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold environments.

ADC Channels: YES

Integrated ADC channels enable analog input functionality, allowing the microcontroller to process and convert external analog signals.

DMA Channels: YES

DMA channels facilitate direct memory operations, enhancing data transfer speeds and reducing CPU workload.

Terminal Position: BOTTOM

Bottom terminal position enhances board layout flexibility and ease of soldering during assembly.

ROM Words: 524288

Large ROM capacity enables storing a vast amount of program instructions and data for efficient operation.

Maximum Seated Height: 1.2 mm

Low seated height profile is beneficial for compact designs and applications with space constraints.

Width: 9 mm

Compact width dimension fits well in various circuit board layouts and designs.

External Data Bus Width: 32

A wide external data bus width of 32 bits allows for efficient data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency capability ensures fast processing speeds and responsiveness in real-time applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering during manufacturing processes.

Length: 9 mm

Compact length dimension allows for flexible placement and integration within electronic systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Belongs to the RISC architecture, providing efficient processing capabilities suitable for various embedded applications.

RAM Bytes: 106496

Generous RAM capacity allows for efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency and reliability.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and reliable electrical connections during assembly.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation in various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of firmware and software applications.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm enables high-density mounting and efficient PCB layout design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, suitable for standard assembly and reflow processes.

Speed: 204 rpm

High speed rating ensures fast processing and response times for real-time applications.

No. of I/O Lines: 49

A high number of I/O lines provide ample connectivity options for interfacing with various devices and peripherals.

Technical Specifications

Microcontrollers LPC4323JET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

106496

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC4323JET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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