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LPC2292FET144/01,5

NXP Semiconductors

LPC2292FET144/01,5 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;

Median Price

$21.945

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 8 parts In-Stock

1+ parts

$9.167

100+ parts

-

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8

$9.167

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Rochester

USA . 49 parts In-Stock

1+ parts

$19.260

100+ parts

$18.100

1k+ parts

$16.370

10k+ parts

-

49

$19.260

$18.100

$16.370

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Mouser Electronics

USA . 189 parts In-Stock

1+ parts

$24.630

100+ parts

$21.700

1k+ parts

$19.330

10k+ parts

-

189

$24.630

$21.700

$19.330

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Arrow

USA . 63 parts In-Stock

1+ parts

$29.070

100+ parts

$20.200

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$18.600

10k+ parts

$18.600

63

$29.070

$20.200

$18.600

$18.600

DigiKey

USA . 114 parts In-Stock

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$29.600

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$29.600

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Chip1Stop

Japan . 67 parts In-Stock

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$16.480

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$16.480

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Distributors (In-Stock)

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Digiode

USA . 3,998 parts In-Stock

1+ parts

$8.709

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$8.709

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Vyrian

USA . 12,276 parts In-Stock

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Component Sense

UK . 3,636 parts In-Stock

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Anansix

USA . 2,584 parts In-Stock

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Inventory MP

USA . 6 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 891 parts In-Stock

1+ parts

$8.250

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891

$8.250

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Component Stockers USA

USA . 344 parts In-Stock

1+ parts

$17.250

100+ parts

$23.070

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344

$17.250

$23.070

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Vigor

Singapore . 94 parts In-Stock

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$26.350

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94

$26.350

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$44.107

100+ parts

$40.137

1k+ parts

$36.168

10k+ parts

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700

$44.107

$40.137

$36.168

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Microchip USA

USA . 2,109 parts In-Stock

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$70.771

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2,109

$70.771

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UNI Independent Distributors

Spain . 5,682 parts In-Stock

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5,682

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Technical Specifications

Microcontrollers LPC2292FET144/01,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B144

Length:

12 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

112

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

LPC2292FET144/01,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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