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LPC1853JET256,551

NXP Semiconductors

LPC1853JET256,551 by NXP Semiconductors

LPC1853JET256,551 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in extreme temps from -40 °C to 105 °C. It includes ADC and PWM channels, making it ideal for industrial applications. With 256 terminals and flash ROM, it's versatile for various embedded systems.

Median Price

$11.656

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Verical

USA . 9,990 parts In-Stock

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Vyrian

USA . 5,220 parts In-Stock

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Flip Electronics

USA . 3,600 parts In-Stock

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Digiode

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Anansix

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AZTECH Wire

Italy . 741 parts In-Stock

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Spain . 6,544 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Corphita

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Overview

Elevate your next project with the LPC1853JET256,551 microcontroller from NXP Semiconductors, a leader in innovation and quality. Designed for demanding applications, this robust 32-bit processor delivers exceptional performance while ensuring reliability in extreme conditions. Experience versatile connectivity options and efficient power management, making it ideal for industrial automation, IoT devices, and beyond. Trust NXP’s legacy of excellence to bring your ideas to life seamlessly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure the microcontroller is robust and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and supports automated assembly processes.

Maximum Supply Voltage: 3.6 V

The microcontroller operates within standard voltage ranges, making it compatible with a wide range of power supplies.

Package Shape: SQUARE

The square shape facilitates easier placement on PCBs and may improve thermal management.

Bit Size: 32

A 32-bit architecture enables complex computations and efficient processing, making it suitable for demanding applications.

Power Supplies (V): 2.5/3.3

Supports multiple supply voltages, allowing for flexible power management in various systems.

No. of Terminals: 256

A high number of terminals allows for extensive connectivity and interfacing with diverse components.

Package Style (Meter): GRID ARRAY

The grid array style offers improved performance characteristics, including electrical and thermal properties.

Minimum Supply Voltage: 2.2 V

Wide voltage operating range allows for flexibility in power supply design.

Maximum Operating Temperature: 105 °C

High operating temperature range makes the microcontroller suitable for industrial and rugged applications.

CPU Family: CORTEX-M3

The Cortex-M3 core provides high performance with low power consumption, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures makes it suitable for harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finishing offers good solderability and corrosion resistance, enhancing product reliability.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, expanding application capabilities.

DMA Channels: YES

DMA support enables efficient data transfer, freeing up CPU resources for other tasks, enhancing system performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates compact designs and effective heat dissipation.

ROM Words: 524288

Ample ROM allows for extensive program storage, accommodating complex applications.

Width: 17 mm

Compact size helps save space on PCB layouts, making it ideal for small devices.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz provides the necessary speed for responsive applications.

Maximum Time At Peak Reflow Temperature: 30 s

Compatibility with standard reflow soldering processes ensures ease of manufacturing.

Peak Reflow Temperature: 260 °C

High peak reflow temperature tolerance implies durability during manufacturing processes.

Length: 17 mm

The compact length contributes to the overall space efficiency of the design.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes performance and power efficiency, making it ideal for embedded systems.

RAM Bytes: 139264

Sufficient RAM size supports data-intensive applications, allowing for enhanced functionality.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form enhances connectivity and helps facilitate automated soldering processes.

Nominal Supply Voltage: 3.3 V

Nominal voltage aligns with common digital logic levels, increasing compatibility with other devices.

PWM Channels: YES

Inclusion of PWM channels makes the microcontroller suitable for motor control and signal modulation applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, enhancing versatility.

Terminal Pitch: 1 mm

1 mm terminal pitch facilitates dense packing of components while ensuring reliable connections.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, ensuring proper handling during manufacturing.

Speed: 180 rpm

This speed indicates the controller's capabilities, potentially improving performance in applications requiring fast response times.

No. of I/O Lines: 164

A significant number of I/O lines allows for extensive device interfacing, supporting a wide range of applications.

Technical Specifications

Microcontrollers LPC1853JET256,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC1853JET256,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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