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LPC1853JBD208E

NXP Semiconductors

LPC1853JBD208E by NXP Semiconductors

NXP Semiconductors LPC1853JBD208E is a 32-bit microcontroller with Cortex-M3 CPU, 524288 ROM words, and 139264 RAM bytes. It operates at up to 25 MHz clock frequency and has 142 I/O lines for industrial applications requiring high-speed processing and extensive memory capabilities.

Median Price

$17.443

Lifecycle Status

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12

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,559 parts In-Stock

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$18.282

100+ parts

$12.230

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$12.113

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$18.282

$12.230

$12.113

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Arrow

USA . 119 parts In-Stock

1+ parts

$18.591

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$11.595

1k+ parts

$11.068

10k+ parts

$10.949

119

$18.591

$11.595

$11.068

$10.949

Mouser Electronics

USA . 36 parts In-Stock

1+ parts

$22.830

100+ parts

$16.580

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$13.040

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36

$22.830

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$13.040

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DigiKey

USA . 170 parts In-Stock

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$14.370

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Flip Electronics (Authorized)

USA . 170 parts In-Stock

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Verical

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Rochester

USA . 72 parts In-Stock

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$11.120

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$9.950

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$9.370

72

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$9.950

$9.370

Distributors (In-Stock)

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Digiode

USA . 1,687 parts In-Stock

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$17.240

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1,687

$17.240

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Vyrian

USA . 6,264 parts In-Stock

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Anansix

USA . 2,852 parts In-Stock

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Nova Conductors

Japan . 25 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 422 parts In-Stock

1+ parts

$12.210

100+ parts

$11.905

1k+ parts

$11.844

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422

$12.210

$11.905

$11.844

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Corohmni

South Africa . 802 parts In-Stock

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$15.115

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Corphita

USA . 2,202 parts In-Stock

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$16.332

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Vigor

Singapore . 2,695 parts In-Stock

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$16.747

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Microchip USA

USA . 1,422 parts In-Stock

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$45.903

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Component Stockers USA

USA . 185 parts In-Stock

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$192.110

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S.R.D Solutions

India . 70,000 parts In-Stock

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Lixinc

USA . 15,094 parts In-Stock

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Argo Parts USA

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Continental Prestige Electronics

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UNI Independent Distributors

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Aranea Global

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Perfect Parts

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Overview

Unleash the power of innovation with the LPC1853JBD208E by NXP Semiconductors. Crafted with precision and expertise, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, this Cortex-M3 CPU family device provides seamless performance and efficiency. With a robust package body material and advanced technology, the LPC1853JBD208E ensures optimal functionality in industrial settings. Experience the value of cutting-edge technology and elevate your projects with this exceptional microcontroller from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications without the risk of damaging the microcontroller.

Package Shape: SQUARE

Simplifies the design and layout of the circuit board.

Bit Size: 32

Offers high processing power and efficiency for various tasks.

Power Supplies (V): 2.5/3.3

Provides flexibility in power input options for different system requirements.

No. of Terminals: 208

Allows for multiple connections and interfaces with other components.

Package Style (Meter): FLATPACK

Facilitates efficient heat dissipation and compact design of the microcontroller.

Minimum Supply Voltage: 2.2 V

Ensures stable operation even at low power input.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications with high temperature environments.

CPU Family: CORTEX-M3

Offers advanced processing capabilities and performance for demanding tasks.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without any issues.

Terminal Finish: TIN

Enhances the durability and conductivity of the terminal connections.

ADC Channels: YES

Allows for analog signal processing and conversion.

DMA Channels: YES

Enables efficient data transfer and processing with minimal CPU intervention.

Terminal Position: QUAD

Optimizes the layout and connections on the circuit board.

ROM Words: 524288

Offers ample memory storage for program data and instructions.

Width: 28 mm

Compact size for space-constrained applications.

Maximum Clock Frequency: 25 MHz

Provides fast processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Resistant to high temperatures during assembly processes.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing.

Length: 28 mm

Compact size for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Optimized for embedded system applications and efficient processing.

RAM Bytes: 139264

Sufficient random-access memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Provides secure and reliable connections on the circuit board.

Nominal Supply Voltage: 3.3 V

Standard power input for most applications.

PWM Channels: YES

Allows for precise control of analog signals.

ROM Programmability: FLASH

Easily programmable and reprogrammable for firmware updates.

Terminal Pitch: 0.5 mm

Fine pitch for compact layout and efficient connections.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering and moisture-sensitive environments.

Speed: 180 rpm

Efficient processing speed for various applications.

No. of I/O Lines: 142

Plenty of input/output options for interfacing with external devices.

Technical Specifications

Microcontrollers LPC1853JBD208E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

142

No. of Terminals:

208

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

LPC1853JBD208E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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