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LPC1853FET256,551

NXP Semiconductors

LPC1853FET256,551 by NXP Semiconductors

NXP Semiconductors' LPC1853FET256,551 is a 32-bit microcontroller with Cortex-M3 CPU, 24-bit address bus, and 32-bit external data bus. It operates b/w -40 to 85°C and has a max clock frequency of 25 MHz. Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

$14.878

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 95 parts In-Stock

1+ parts

$9.409

100+ parts

$8.352

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95

$9.409

$8.352

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Chip1Stop

Japan . 360 parts In-Stock

1+ parts

$18.200

100+ parts

$12.300

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$11.200

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360

$18.200

$12.300

$11.200

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DigiKey

USA . 178 parts In-Stock

1+ parts

$19.900

100+ parts

$13.800

1k+ parts

$12.850

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178

$19.900

$13.800

$12.850

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Verical

USA . 9,990 parts In-Stock

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$11.557

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$11.557

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Flip Electronics (Authorized)

USA . 211 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,041 parts In-Stock

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$8.939

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1,041

$8.939

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Nova Conductors

Japan . 91 parts In-Stock

1+ parts

$14.060

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91

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Vyrian

USA . 8,092 parts In-Stock

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Anansix

USA . 2,125 parts In-Stock

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Semtec, LLC

USA . 705 parts In-Stock

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705

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Flip Electronics

USA . 146 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 314 parts In-Stock

1+ parts

$8.000

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314

$8.000

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Semicontronic

India . 121 parts In-Stock

1+ parts

$8.000

100+ parts

$7.800

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$7.760

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121

$8.000

$7.800

$7.760

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Corphita

USA . 380 parts In-Stock

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$8.468

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380

$8.468

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Modulus Dynamics

Lithuania . 959 parts In-Stock

1+ parts

$14.060

100+ parts

$14.060

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$14.060

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959

$14.060

$14.060

$14.060

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Corohmni

South Africa . 398 parts In-Stock

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$14.060

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398

$14.060

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Continental Prestige Electronics

USA . 6,857 parts In-Stock

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$14.060

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$13.779

6,857

$14.060

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$13.779

Aztec Data Supply Inc.

USA . 3,868 parts In-Stock

1+ parts

$45.340

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3,868

$45.340

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Microchip USA

USA . 2,269 parts In-Stock

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$47.173

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2,269

$47.173

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UNI Independent Distributors

Spain . 6,146 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$13.779

1k+ parts

$13.357

10k+ parts

$13.076

2,000

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$13.779

$13.357

$13.076

Argo Parts USA

USA . 1,744 parts In-Stock

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Perfect Parts

USA . 202 parts In-Stock

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Glotronic Ltd.

UK . 72 parts In-Stock

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Overview

Unlock the power of innovation with the LPC1853FET256,551 by NXP Semiconductors. As a leader in microcontrollers, NXP delivers quality and reliability in every product. Ideal for a wide range of applications, this microcontroller offers unparalleled performance and efficiency. From its advanced features to its versatile capabilities, the LPC1853FET256,551 provides value and benefits that exceed expectations. Choose NXP for cutting-edge technology that drives success in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of this microcontroller on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, increasing versatility in different electronic systems.

Address Bus Width: 24

The 24-bit address bus width enables this microcontroller to access a large memory space, catering to more complex computational tasks.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving valuable space on PCBs and allowing for denser designs.

Bit Size: 32

This microcontroller's 32-bit architecture offers enhanced processing capabilities, making it suitable for applications requiring high computational power.

DAC Channels: YES

The presence of DAC channels allows for precise analog signal output, making this microcontroller ideal for applications requiring accurate voltage control.

Power Supplies (V): 2.5/3.3

The support for multiple power supply voltages provides flexibility in designing circuits and compatibility with various power sources.

No. of Terminals: 256

With 256 terminals, this microcontroller offers ample I/O options for connecting to external components, enhancing its versatility in system integration.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style simplifies installation and ensures mechanical stability, contributing to a reliable circuit design.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage requirement allows for efficient power consumption, making this microcontroller suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environments, increasing the durability of this microcontroller.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers a balance of performance and power efficiency, making this microcontroller a suitable choice for diverse embedded applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this microcontroller can function reliably in cold environments, expanding its range of potential applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability in circuit connections.

ADC Channels: YES

The availability of ADC channels allows for accurate analog signal conversion, making this microcontroller well-suited for applications requiring precise sensor data processing.

DMA Channels: YES

Built-in DMA channels enable efficient data transfer between peripherals and memory, enhancing system performance in data-intensive applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB layout and routing, streamlining the design process and ensuring proper signal connectivity.

ROM Words: 524288

With a large ROM capacity of 524288 words, this microcontroller can store extensive program code, offering ample memory for complex software algorithms.

Maximum Seated Height: 1.55 mm

The low maximum seated height allows for space-efficient PCB stack-up designs, enabling compact and slim electronic devices.

Width: 17 mm

The 17mm width of this microcontroller makes it suitable for applications with space constraints, providing a compact solution for integrating advanced functionalities.

External Data Bus Width: 32

A 32-bit external data bus width enables rapid data transfers, enhancing the performance of this microcontroller in data-intensive applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz supports fast data processing speeds, making this microcontroller suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature simplifies the soldering process, ensuring reliable and efficient assembly of this microcontroller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper solder melting and joint formation, contributing to robust PCB assembly.

Length: 17 mm

The 17mm length of this microcontroller offers a compact footprint, making it suitable for applications requiring space-saving solutions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation across a wide range of environmental conditions, making this microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller, RISC-based peripheral IC type offers efficient processing capabilities, making this product suitable for embedded systems requiring high performance.

RAM Bytes: 139264

This microcontroller's large RAM capacity of 139264 bytes provides ample memory for data storage and processing, supporting multitasking and complex applications.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, enhancing overall system reliability and efficiency.

Terminal Form: BALL

The ball terminal form simplifies soldering and ensures reliable electrical connections, making this microcontroller user-friendly for assembly and maintenance.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this microcontroller is compatible with standard power sources, offering ease of integration into various electronic systems.

PWM Channels: YES

The availability of PWM channels allows for precise control of pulse-width modulation signals, making this microcontroller ideal for applications requiring accurate signal modulation.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and fast program updates, enabling flexibility and scalability in software development for this microcontroller.

Terminal Pitch: 1 mm

The 1mm terminal pitch simplifies PCB layout and routing, facilitating easy integration of this microcontroller into electronic circuit designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller is suitable for standard reflow soldering processes, ensuring optimal performance during assembly.

Speed: 180 rpm

The speed of 180 rpm indicates the operational efficiency of this microcontroller, making it a reliable choice for applications requiring consistent and fast data processing.

No. of I/O Lines: 164

With 164 I/O lines, this microcontroller offers ample connectivity options for interfacing with external devices, enhancing its versatility in system integration.

Technical Specifications

Microcontrollers LPC1853FET256,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.55 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC1853FET256,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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