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LPC1850FBD208,551

NXP Semiconductors

LPC1850FBD208,551 by NXP Semiconductors

LPC1850FBD208,551 by NXP is a 32-bit microcontroller ideal for industrial applications. It operates b/w -40 °C to 85 °C, features 204.8KB RAM, and supports dual power supplies of 2.5/3.3V. Its compact flatpack design ensures efficient surface mounting in various devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 10,751 parts In-Stock

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Digiode

USA . 4,282 parts In-Stock

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Anansix

USA . 2,647 parts In-Stock

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One Stop Electronics

USA . 1,301 parts In-Stock

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$10.000

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Microchip USA

USA . 396 parts In-Stock

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$15.023

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AZTECH Wire

Italy . 717 parts In-Stock

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$18.910

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Component Stockers USA

USA . 445 parts In-Stock

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$99.990

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UNI Independent Distributors

Spain . 7,815 parts In-Stock

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Corphita

USA . 3,040 parts In-Stock

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Overview

Elevate your design with the LPC1850FBD208,551 from NXP Semiconductors—a leader in advanced microcontroller technology. This robust 32-bit solution excels in industrial applications, ensuring reliability even in extreme temperatures. With its superior performance and energy efficiency, it empowers your projects to achieve outstanding results. Experience seamless integration, enhanced functionality, and peace of mind with a product backed by NXP's commitment to quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space, facilitating compact and modern circuit design.

Package Shape: SQUARE

A square package shape promotes uniformity in layout and simplifies circuit design, enhancing manufacturability.

Bit Size: 32

A 32-bit architecture allows for increased processing power and efficiency, making the microcontroller suitable for complex tasks.

Power Supplies (V): 2.5/3.3

The dual voltage supply options provide flexibility in design, allowing compatibility with various systems and components.

No. of Terminals: 208

Having a higher number of terminals provides more I/O options, enabling the connection of multiple peripherals and enhancing functionality.

Package Style (Meter): FLATPACK

Flatpack style is advantageous for saving space and creating low-profile devices, ideal for compact applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability in demanding environments, making this product suitable for industrial applications.

CPU Family: CORTEX-M3

The Cortex-M3 core is known for its performance and low power consumption, making it ideal for embedded applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this microcontroller is capable of functioning in extreme conditions, enhancing its application range.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of signals on the PCB, simplifying the design process.

ROM Words: 65536

A substantial ROM capacity affords ample space for program storage, supporting complex applications and functionalities.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures reliable operation in harsh environments, suited for long-term applications.

RAM Bytes: 204800

A large RAM size enables the execution of complex algorithms and data handling, improving performance in demanding applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and enhances electrical performance, simplifying assembly.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is beneficial for high-density circuits, allowing for more connections in limited space.

Speed: 150 rpm

Operating at 150 rpm strikes a balance between performance and power consumption, making it suitable for various embedded systems.

Technical Specifications

Microcontrollers LPC1850FBD208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQFP-G208

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

204800

ROM Words:

65536

ROM Programmability:

UVPROM

Speed:

150 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LPC1850FBD208,551 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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