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LPC1830FET256

NXP Semiconductors

LPC1830FET256 by NXP Semiconductors

LPC1830FET256 by NXP Semiconductors is a 32-bit microcontroller with a max clock frequency of 25 MHz. It has 164 I/O lines and can operate in industrial temperature range (-40 to 85 °C). This microcontroller is commonly used in applications requiring high-speed processing and extensive input/output capabilities.

Median Price

$14.265

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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DigiKey

USA . 820 parts In-Stock

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$14.670

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$14.670

Flip Electronics (Authorized)

USA . 820 parts In-Stock

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Verical

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Vyrian

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Chip Stock

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Anansix

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Digiode

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DigiKey Marketplace

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Flip Electronics

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Bristol Electronics

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Nova Conductors

Japan . 10 parts In-Stock

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Semicontronic

India . 527 parts In-Stock

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$12.470

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$12.158

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$12.096

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Ampacity Inc.

Singapore . 451 parts In-Stock

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Microchip USA

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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UNI Independent Distributors

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Kepictronics

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Aranea Global

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Overview

Looking for a high-quality microcontroller that offers unparalleled performance and versatility? Look no further than the LPC1830FET256 by NXP Semiconductors. With its cutting-edge technology and extensive range of applications, this microcontroller is a game-changer. Whether you're developing IoT devices, automotive systems, or industrial control solutions, the LPC1830FET256 has got you covered. Its advanced features, such as ADC channels, DMA channels, and PWM channels, allow for seamless integration and enhanced functionality. Plus, with NXP Semiconductors' reputation for excellence and innovation, you can trust that this product delivers on its promises. Upgrade your projects today and experience the value, benefits, and advantages that the LPC1830FET256 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable plastic/epoxy package body material, ensuring its longevity and reliability.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation, making this microcontroller a convenient choice.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, providing versatility and compatibility.

Address Bus Width: 24

The larger address bus width of 24 allows for more memory addresses, enabling this microcontroller to handle complex tasks and data manipulation effectively.

Package Shape: SQUARE

The square package shape provides a compact design, allowing for efficient use of space in electronic applications.

Bit Size: 32

With a 32-bit size, this microcontroller can process data and instructions more efficiently, resulting in enhanced performance.

DAC Channels: YES

The presence of DAC channels allows for high-quality analog output, making this microcontroller suitable for applications that require precise analog signals.

No. of Terminals: 256

The abundance of terminals provides ample connectivity options, making it easier to integrate this microcontroller into various systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers high-density packaging, making it ideal for applications where space is limited.

Minimum Supply Voltage: 2.2 V

With a low minimum supply voltage, this microcontroller can operate efficiently even with lower power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this microcontroller to be used in environments with elevated temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

This microcontroller's ability to operate reliably even at extremely low temperatures makes it suitable for applications in colder environments.

ADC Channels: YES

Equipped with ADC channels, this microcontroller can accurately convert analog signals to digital data, making it a versatile choice for various applications.

DMA Channels: YES

The presence of DMA channels enables this microcontroller to efficiently transfer data between peripherals and memory, enhancing overall performance.

Terminal Position: BOTTOM

With the terminal position at the bottom, this microcontroller can be easily integrated into circuit boards with vertical connections.

Maximum Seated Height: 1.55 mm

The low maximum seated height ensures that this microcontroller can fit into compact spaces, allowing for flexibility in design.

Width: 17 mm

The narrow width of this microcontroller makes it ideal for applications where space-saving is crucial.

External Data Bus Width: 32

The wide external data bus width of 32 allows for efficient data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 25 MHz

With a high maximum clock frequency, this microcontroller can execute instructions at a faster rate, resulting in improved overall performance.

Peak Reflow Temperature °C: 260

This microcontroller can withstand high peak reflow temperatures during soldering processes, ensuring reliable assembly.

Length: 17 mm

The compact length of this microcontroller facilitates integration into smaller electronic systems.

Temperature Grade: INDUSTRIAL

Designed to withstand demanding industrial environments, this microcontroller is highly durable and reliable.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller features a RISC microarchitecture, which offers efficient instruction execution, enhancing its performance.

Technology: CMOS

Built using CMOS technology, this microcontroller consumes less power and provides higher speed compared to other technologies.

Terminal Form: BALL

The ball terminal form simplifies the soldering process, making this microcontroller easier to integrate into circuit boards.

Nominal Supply Voltage: 3.3 V

With a stable nominal supply voltage, this microcontroller can operate reliably within a specified voltage range.

PWM Channels: YES

Equipped with PWM channels, this microcontroller can generate precise pulse-width-modulated signals, making it suitable for tasks such as motor control.

ROM Programmability: FLASH

The ROM programmability using flash memory allows for easy and quick updates to the microcontroller's firmware, providing flexibility in application development.

Terminal Pitch: 1 mm

The small terminal pitch of 1 mm enables high-density packaging, making this microcontroller suitable for applications with tight space constraints.

Moisture Sensitivity Level (MSL): 3

Featuring an MSL of 3, this microcontroller has a moderate moisture sensitivity, ensuring reliable performance during production and assembly processes.

Speed: 180 rpm

With a speed of 180 revolutions per minute (rpm), this microcontroller is suitable for applications requiring specific rotational speeds.

No. of I/O Lines: 164

The abundant number of input/output lines provides extensive connectivity options, making this microcontroller versatile for various applications.

Technical Specifications

Microcontrollers LPC1830FET256 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.55 mm

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC1830FET256 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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