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LPC1765FBD100,551

NXP Semiconductors

LPC1765FBD100,551 by NXP Semiconductors

NXP Semiconductors' LPC1765FBD100,551 is a 32-bit ARM7 microcontroller with 262144 ROM words and 65536 RAM bytes. It operates b/w -40 to 85 °C with a max clock frequency of 25 MHz. Ideal for industrial applications requiring up to 70 I/O lines, PWM and DAC channels.

Median Price

$6.850

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 55 parts In-Stock

1+ parts

-

100+ parts

$6.850

1k+ parts

$6.130

10k+ parts

$5.770

55

-

$6.850

$6.130

$5.770

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.316

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50

$5.316

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Vyrian

USA . 4,416 parts In-Stock

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4,416

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Digiode

USA . 2,194 parts In-Stock

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Anansix

USA . 1,331 parts In-Stock

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Greenchips

USA . 898 parts In-Stock

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898

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Flip Electronics

USA . 110 parts In-Stock

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Semi Source

USA . 46 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 1,148 parts In-Stock

1+ parts

$5.316

100+ parts

-

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1,148

$5.316

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$5.316

100+ parts

$5.050

1k+ parts

$4.798

10k+ parts

$4.731

100

$5.316

$5.050

$4.798

$4.731

Continental Prestige Electronics

USA . 984 parts In-Stock

1+ parts

$5.316

100+ parts

-

1k+ parts

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$5.210

984

$5.316

-

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$5.210

Semicontronic

India . 3,086 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

1k+ parts

$6.790

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3,086

$7.000

$6.825

$6.790

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AZTECH Wire

Italy . 325 parts In-Stock

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$10.058

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$10.058

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Microchip USA

USA . 1,608 parts In-Stock

1+ parts

$17.629

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1,608

$17.629

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One Stop Electronics

USA . 393 parts In-Stock

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$30.000

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393

$30.000

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Aztec Data Supply Inc.

USA . 4,827 parts In-Stock

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$31.320

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4,827

$31.320

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Lixinc

USA . 17,596 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 5,441 parts In-Stock

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Corphita

USA . 4,677 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Futuretech Components

Singapore . 1,500 parts In-Stock

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iodParts Technologies Inc.

India . 455 parts In-Stock

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455

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Argo Parts USA

USA . 15 parts In-Stock

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Overview

Experience the cutting-edge technology of NXP Semiconductors with the LPC1765FBD100,551 microcontroller! This high-quality device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this powerful microcontroller delivers exceptional value and benefits to customers. Trust NXP Semiconductors to provide you with the innovative solutions you need to take your projects to the next level. Elevate your designs with the LPC1765FBD100,551 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort in production.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage provides flexibility in power options and compatibility with a wide range of applications.

Bit Size: 32

A 32-bit architecture allows for faster and more powerful processing capabilities compared to lower bit sizes.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog sensors and devices, expanding its potential uses.

ADC Channels: YES

Analog-to-digital converter channels allow for accurate and precise measurements of analog signals, enhancing the sensor capabilities of the microcontroller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environments and extended use without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in both extreme cold and hot conditions, making it suitable for diverse applications.

RAM Bytes: 65536

With a large RAM capacity, this microcontroller can handle complex tasks and store a significant amount of data, improving overall performance.

ROM Programmability: FLASH

Flash programmable memory allows for easy and quick updates to the microcontroller's firmware, ensuring adaptability to changing requirements.

Technical Specifications

Microcontrollers LPC1765FBD100,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3,3/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC1765FBD100,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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