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LPC1758FBD80,551

NXP Semiconductors

LPC1758FBD80,551 by NXP Semiconductors

NXP Semiconductors' LPC1758FBD80,551 is a 32-bit microcontroller with 80 terminals and 3.3V power supply. Featuring Cortex-M3 CPU family, it offers 6-Ch 12-Bit ADC channels and 1-Ch 10-Bit DAC channel for industrial applications requiring up to 25 MHz clock frequency.

Median Price

$6.994

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$6.994

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Famous Connections Ltd

Bulgaria . 5,000 parts In-Stock

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Digiode

USA . 4,612 parts In-Stock

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Vyrian

USA . 4,390 parts In-Stock

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Anansix

USA . 614 parts In-Stock

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Sensible Micro Corp

USA . 200 parts In-Stock

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Bristol Electronics

USA . 33 parts In-Stock

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Odi Ramu Company

Canada . 5 parts In-Stock

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Cogito LLC

Ukraine . 2 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,667 parts In-Stock

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$6.994

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$6.854

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$6.854

Netroflash

USA . 100 parts In-Stock

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$6.994

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Modulus Dynamics

Lithuania . 657 parts In-Stock

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$6.994

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657

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$6.994

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Advanced Electronics

New Zealand . 15,000 parts In-Stock

1+ parts

$7.204

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$6.844

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$6.844

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$6.844

$6.844

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AZTECH Wire

Italy . 644 parts In-Stock

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$10.367

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Ampacity Inc.

Singapore . 707 parts In-Stock

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$14.000

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One Stop Electronics

USA . 509 parts In-Stock

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Aztec Data Supply Inc.

USA . 334 parts In-Stock

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$27.080

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Semicontronic

India . 2,470 parts In-Stock

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$31.000

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$30.225

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$30.070

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Futuretech Components

Singapore . 12,600 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,496 parts In-Stock

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Microchip USA

USA . 10,823 parts In-Stock

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UNI Independent Distributors

Spain . 5,445 parts In-Stock

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Argo Parts USA

USA . 4,227 parts In-Stock

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Corphita

USA . 3,139 parts In-Stock

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Lixinc

USA . 1,912 parts In-Stock

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corohmni

South Africa . 473 parts In-Stock

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Overview

Unlock the full potential of your electronic projects with the LPC1758FBD80,551 by NXP Semiconductors. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this cutting-edge device delivers seamless connectivity and efficient operation. Experience the value and benefits of NXP Semiconductors' top-notch technology in every project you undertake. Elevate your designs with the LPC1758FBD80,551 and revolutionize the way you create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the product a good choice for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, making it a convenient choice for manufacturing processes.

Maximum Supply Voltage: 3.6 V

Provides a versatile power range for different applications, making the product suitable for a variety of projects.

Package Shape: SQUARE

The square shape allows for compact and space-efficient design, making the product suitable for small devices.

Bit Size: 32

With a 32-bit architecture, the product offers high performance and processing power for complex tasks, making it a reliable choice for demanding applications.

Technical Specifications

Microcontrollers LPC1758FBD80,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

52

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI, SSP(2), UART(4)

Peripherals:

BOD, DMA(8), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC1758FBD80,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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