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LPC1751FBD80,551

NXP Semiconductors

LPC1751FBD80,551 by NXP Semiconductors

NXP Semiconductors' LPC1751FBD80,551 is a 32-bit microcontroller with Cortex-M3 CPU. It operates at 25 MHz, has 6 ADC channels, and 52 I/O lines. Suitable for industrial applications, it features 8 KB RAM, FLASH ROM programmability, and various peripherals like BOD and RTC.

Median Price

$4.590

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 2,380 parts In-Stock

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Rochester

USA . 495 parts In-Stock

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$4.590

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$4.110

10k+ parts

$3.860

495

-

$4.590

$4.110

$3.860

Distributors (In-Stock)

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Digiode

USA . 4,899 parts In-Stock

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$3.745

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4,899

$3.745

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Nova Conductors

Japan . 200 parts In-Stock

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$4.569

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Flip Electronics

USA . 4,998 parts In-Stock

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Vyrian

USA . 4,037 parts In-Stock

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Anansix

USA . 2,537 parts In-Stock

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Bristol Electronics

USA . 42 parts In-Stock

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Semtec, LLC

USA . 21 parts In-Stock

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Corphita

USA . 2,164 parts In-Stock

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$3.548

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Continental Prestige Electronics

USA . 6,737 parts In-Stock

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$4.569

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$4.478

6,737

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$4.478

AZTECH Wire

Italy . 188 parts In-Stock

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$9.910

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Microchip USA

USA . 2,264 parts In-Stock

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$11.073

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Aztec Data Supply Inc.

USA . 90 parts In-Stock

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$43.131

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Corohmni

South Africa . 432 parts In-Stock

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$49.943

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UNI Independent Distributors

Spain . 7,269 parts In-Stock

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Argo Parts USA

USA . 3,378 parts In-Stock

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Lixinc

USA . 1,840 parts In-Stock

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Perfect Parts

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Netroflash

USA . 500 parts In-Stock

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$4.478

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$4.341

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$4.250

500

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$4.478

$4.341

$4.250

Overview

Unlock the possibilities with the LPC1751FBD80,551 microcontroller by NXP Semiconductors. Designed with cutting-edge technology and superior quality, this device offers unmatched performance and reliability in a variety of applications. From industrial automation to consumer electronics, this microcontroller delivers value and versatility like never before. Experience seamless connectivity, efficient power management, and advanced peripherals all in one compact package. Trust NXP Semiconductors to bring you the best in microcontroller innovation. Elevate your projects with the LPC1751FBD80,551.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides durability and protection for the microcontroller, ensuring longer lifespan and better performance.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for versatility in power supply options, making it compatible with a wider range of applications.

Bit Size: 32

A 32-bit architecture allows for faster processing speeds and more memory addressability, making the microcontroller suitable for complex tasks.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and devices, expanding its range of applications.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency allows for efficient and fast processing of instructions, making the microcontroller suitable for time-sensitive applications.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can efficiently store and access temporary data during operation, enhancing its processing capabilities.

Connectivity: I2C(2), SPI, SSP(2), UART(4)

Multiple connectivity options such as I2C, SPI, and UART enable the microcontroller to communicate with various external devices, expanding its compatibility and functionality.

Technical Specifications

Microcontrollers LPC1751FBD80,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

52

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI, SSP(2), UART(4)

Peripherals:

BOD, DMA(8), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

LPC1751FBD80,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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