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LPC1317FBD64,551

NXP Semiconductors

LPC1317FBD64,551 by NXP Semiconductors

NXP Semiconductors' LPC1317FBD64,551 is a 32-bit microcontroller with 3.3V power supply, 25MHz clock frequency, and 8192 bytes of RAM. Ideal for industrial applications, it features a Cortex-M3 CPU family and FLASH ROM programmability for efficient processing and storage capabilities.

Median Price

$6.468

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 60 parts In-Stock

1+ parts

$7.110

100+ parts

$4.510

1k+ parts

$3.930

10k+ parts

$3.890

60

$7.110

$4.510

$3.930

$3.890

Flip Electronics (Authorized)

USA . 1,750 parts In-Stock

1+ parts

-

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1,750

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DigiKey

USA . 1,440 parts In-Stock

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-

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$5.600

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1,440

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$5.600

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Verical

USA . 1,440 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$6.468

10k+ parts

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1,440

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$6.468

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$5.280

100+ parts

-

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10

$5.280

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Digiode

USA . 4,414 parts In-Stock

1+ parts

$6.555

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4,414

$6.555

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Vyrian

USA . 3,204 parts In-Stock

1+ parts

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3,204

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Flip Electronics

USA . 1,440 parts In-Stock

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1,440

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Rebound Electronics

UK . 396 parts In-Stock

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396

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Anansix

USA . 214 parts In-Stock

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214

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,764 parts In-Stock

1+ parts

$4.948

100+ parts

-

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1,764

$4.948

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Modulus Dynamics

Lithuania . 1,111 parts In-Stock

1+ parts

$4.948

100+ parts

$4.948

1k+ parts

$4.948

10k+ parts

-

1,111

$4.948

$4.948

$4.948

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Continental Prestige Electronics

USA . 2,478 parts In-Stock

1+ parts

$5.280

100+ parts

-

1k+ parts

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10k+ parts

$5.175

2,478

$5.280

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-

$5.175

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.280

100+ parts

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100

$5.280

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Advanced Electronics

New Zealand . 140 parts In-Stock

1+ parts

$5.386

100+ parts

$5.386

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$5.386

10k+ parts

-

140

$5.386

$5.386

$5.386

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Semicontronic

India . 747 parts In-Stock

1+ parts

$5.870

100+ parts

$5.723

1k+ parts

$5.694

10k+ parts

-

747

$5.870

$5.723

$5.694

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Ampacity Inc.

Singapore . 696 parts In-Stock

1+ parts

$5.870

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696

$5.870

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Corphita

USA . 1,690 parts In-Stock

1+ parts

$6.210

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1,690

$6.210

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Vigor

Singapore . 320 parts In-Stock

1+ parts

$6.770

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320

$6.770

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Microchip USA

USA . 3,296 parts In-Stock

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$23.800

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3,296

$23.800

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Aztec Data Supply Inc.

USA . 1,157 parts In-Stock

1+ parts

$79.940

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1,157

$79.940

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 1,961 parts In-Stock

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UNI Independent Distributors

Spain . 1,648 parts In-Stock

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1,648

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Overview

Discover the LPC1317FBD64,551 by NXP Semiconductors, a top-tier microcontroller designed for cutting-edge applications. With NXP's stellar reputation for quality and innovation, this product offers unmatched value with its powerful 32-bit Cortex-M3 CPU family, versatile ADC channels, and Flash ROM programmability. Ideal for industrial-grade projects, this microcontroller boasts a wide operating temperature range and low profile package style. Unlock endless possibilities with the LPC1317FBD64,551 and take your designs to new heights of performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring its longevity and reliability.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs without risk of damage, making it versatile for different applications.

Package Shape: SQUARE

Square shape simplifies PCB design and layout, optimizing space utilization in electronic devices.

Bit Size: 32

Provides a good balance between processing power and energy efficiency for various computing tasks.

Power Supplies (V): 3.3

Operates at a standard voltage level, making it compatible with common power sources and peripherals.

No. of Terminals: 64

Offers sufficient input/output connections for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and slim package design, ideal for space-constrained applications such as portable devices.

Minimum Supply Voltage: 2 V

Can operate at lower voltages for power-saving applications or when power source conditions vary.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably in high-temperature environments, suitable for industrial and automotive applications.

CPU Family: CORTEX-M3

Features a robust Cortex-M3 processor architecture for efficient performance in embedded systems and IoT devices.

Minimum Operating Temperature: -40 °C

Designed to withstand extreme cold conditions, ensuring operation in a wide range of environments.

Terminal Finish: TIN

Tin finish provides good solderability and corrosion resistance, enhancing the reliability of connections.

ADC Channels: YES

Incorporates analog-to-digital converters for interfacing with analog sensors and signals in the system.

Terminal Position: QUAD

Quad terminal layout enables efficient routing of signals and reduces signal interference in the circuit design.

ROM Words: 65536

Ample ROM size for storing program instructions and data, allowing for complex software applications to run smoothly.

Maximum Seated Height: 1.6 mm

Low-profile design facilitates thin and compact product designs, crucial for space-constrained applications.

Width: 10 mm

Compact width dimensions enable integration in slim electronic devices without compromising performance.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast processing speeds, enhancing the overall performance of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable solder joints during reflow soldering processes, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, crucial for assembly processes in electronics manufacturing.

Length: 10 mm

Compact length dimensions contribute to overall miniaturization of electronic products, saving space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable operation in harsh environments with temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and built-in peripheral support make it a versatile microcontroller for various embedded system applications.

RAM Bytes: 8192

Adequate RAM size for temporary data storage and efficient multitasking operations within the system.

Technology: CMOS

CMOS technology offers a balance of performance, energy efficiency, and cost-effectiveness in semiconductor fabrication.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections during soldering processes, ensuring long-term functionality.

Nominal Supply Voltage: 3.3 V

Standard nominal voltage level for stable operation and compatibility with commonly used power supplies and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and data storage flexibility in the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact layout designs and efficient signal routing on densely packed circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates robust moisture resistance, suitable for applications in varying humidity conditions.

Speed: 72 rpm

Effective processing speed for handling complex algorithms and real-time data processing tasks efficiently.

No. of I/O Lines: 51

Sufficient number of input/output lines for interfacing with external devices, sensors, and peripherals in the system.

Technical Specifications

Microcontrollers LPC1317FBD64,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC1317FBD64,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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