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LPC1226FBD64/301,1

NXP Semiconductors

LPC1226FBD64/301,1 by NXP Semiconductors

LPC1226FBD64/301,1 from NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates at temperatures from -40 °C to 85 °C. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile applications in industrial automation. With 64 terminals and low-profile packaging, it's ideal for compact designs.

Median Price

$6.466

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12 parts In-Stock

1+ parts

$4.440

100+ parts

$4.170

1k+ parts

$3.770

10k+ parts

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12

$4.440

$4.170

$3.770

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Arrow

USA . 160 parts In-Stock

1+ parts

$6.466

100+ parts

$5.189

1k+ parts

$4.927

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160

$6.466

$5.189

$4.927

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Verical

USA . 9,920 parts In-Stock

1+ parts

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$6.466

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9,920

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$6.466

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Flip Electronics (Authorized)

USA . 1,440 parts In-Stock

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1,440

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Digiode

USA . 2,038 parts In-Stock

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$3.648

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2,038

$3.648

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Vyrian

USA . 7,874 parts In-Stock

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7,874

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Anansix

USA . 2,596 parts In-Stock

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2,596

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Flip Electronics

USA . 2,239 parts In-Stock

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2,239

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Distributors (Availability)

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Corphita

USA . 2,957 parts In-Stock

1+ parts

$3.456

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2,957

$3.456

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AZTECH Wire

Italy . 464 parts In-Stock

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$12.400

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464

$12.400

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Microchip USA

USA . 1,428 parts In-Stock

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$14.471

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1,428

$14.471

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UNI Independent Distributors

Spain . 577 parts In-Stock

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577

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Overview

Unlock the power of innovation with the LPC1226FBD64/301 from NXP Semiconductors, a trusted leader in microcontroller technology. This robust 32-bit Cortex-M0 microcontroller excels in diverse applications, offering exceptional reliability and performance in industrial environments. With its low power consumption and versatile connectivity options, it empowers engineers to create smarter, more efficient designs, ensuring your projects stay ahead of the curve. Embrace quality and elevate your solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material that ensures the microcontroller can operate in a variety of environments.

Surface Mount: YES

Enables efficient assembly and allows for a compact design, making it suitable for modern electronic applications.

Maximum Supply Voltage: 3.6 V

Ensures compatibility with various low-voltage power supplies, enhancing integration flexibility.

Package Shape: SQUARE

Provides a uniform footprint, making it easier to design layouts for printed circuit boards (PCBs).

Bit Size: 32

Offers a good balance of performance and efficiency for a wide range of applications requiring complex computations.

Power Supplies (V): 3.3

Standard voltage for most microcontrollers, allowing for easy integration with existing systems.

No. of Terminals: 64

Allows for a significant number of connections, which is beneficial for applications requiring multiple I/O operations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ideal for space-constrained applications, facilitating placement on compact PCBs.

Minimum Supply Voltage: 3 V

Provides flexibility in power requirements, making it adaptable to different voltage environments.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperature operation may be necessary.

CPU Family: CORTEX-M0

Utilizes a widely supported architecture, offering a robust ecosystem for development and scalability.

Minimum Operating Temperature: -40 °C

Enables operation in extreme conditions, making it ideal for industrial and automotive applications.

ADC Channels: YES

Allows for the implementation of various sensory applications by directly interfacing with analog inputs.

DMA Channels: YES

Enhances data handling efficiency by allowing data transfer without CPU intervention, increasing overall system performance.

Terminal Position: QUAD

Facilitates easier soldering and assembly on circuit boards, which can reduce production costs.

ROM Words: 98304

Provides sufficient program memory, enabling more complex firmware functionality.

Width: 14 mm

Compact size makes it easy to fit into space-constrained applications.

Peripherals: BOD, COMPARATOR(2), DMA(21), RTC, TIMER(5), WDT

Offers a rich set of peripherals, allowing for greater design flexibility and feature-rich applications.

Maximum Clock Frequency: 25 MHz

Adequate clock speed for a range of applications, ensuring efficient processing capabilities.

Peak Reflow Temperature °C: 260

Compatible with industrial soldering processes, which is crucial for reliable manufacturing.

Length: 14 mm

Compact form factor advantageous for size-limited applications.

Temperature Grade: INDUSTRIAL

Designed for harsh environments, ensuring reliability and durability in critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Combines low power requirements with high performance, making it energy efficient.

RAM Bytes: 8192

Ample RAM for handling data-intensive applications while maintaining performance.

Terminal Form: GULL WING

Provides enhanced mechanical strength and reliability, making soldered connections more robust.

Analog To Digital Converters: 8-Ch 10-Bit

Allows for high-resolution measurement of analog signals, enhancing the quality of data collection.

Nominal Supply Voltage: 3.3 V

Standard supply voltage contributing to power efficiency and reducing energy consumption.

Connectivity: I2C, SPI, SSP, UART(2)

Multiple connectivity options provide flexibility in interfacing with other devices and peripherals.

ROM Programmability: FLASH

Allows for easy and efficient reprogramming, which is essential for development and debugging.

Terminal Pitch: 0.5 mm

Allows for more compact designs and can fit in smaller devices while enabling high-density layouts.

Speed: 45 rpm

Ideal for control applications requiring consistent and reliable operation.

On Chip Program ROM Width: 8

Supports a wide array of applications through extensive programmability.

No. of I/O Lines: 55

Provides ample I/O options for a variety of interfacing needs, enabling more complex system designs.

Technical Specifications

Microcontrollers LPC1226FBD64/301,1 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

55

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

98304

ROM Programmability:

FLASH

Speed:

45 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, SSP, UART(2)

Peripherals:

BOD, COMPARATOR(2), DMA(21), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1226FBD64/301,1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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