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LPC11U37FBD48/501,

NXP Semiconductors

LPC11U37FBD48/501, by NXP Semiconductors

The LPC11U37FBD48/501 from NXP is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85 °C. It features 8 ADC channels, 40 I/O lines, and supports USB connectivity. Ideal for industrial applications requiring robust performance.

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1k+

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USA . 6,487 parts In-Stock

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Digiode

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One Stop Electronics

USA . 566 parts In-Stock

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AZTECH Wire

Italy . 851 parts In-Stock

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UNI Independent Distributors

Spain . 7,774 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Corphita

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Overview

Unlock the potential of your designs with the LPC11U37FBD48/501 from NXP Semiconductors—a trusted leader in microcontroller innovation. With its robust performance and energy efficiency, this versatile 32-bit Cortex-M0 microcontroller is perfect for a variety of applications, from industrial automation to consumer electronics. Experience unmatched reliability and seamless connectivity options that elevate your projects, ensuring quality and precision every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction enhances reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for space-saving designs and automated assembly, making it ideal for compact applications.

Maximum Supply Voltage: 3.6 V

This voltage compatibility ensures the microcontroller can work with widely available power supplies, minimizing design constraints.

Package Shape: SQUARE

The square package shape provides ease of PCB layout and uniform thermal distribution.

Bit Size: 32

The 32-bit architecture offers enhanced performance and supports complex applications, improving processing capabilities.

Power Supplies (V): 3.3

Standard 3.3V supply simplifies integration with other components in modern electronic circuits.

Number of Terminals: 48

A higher number of terminals allows for more peripherals and greater flexibility in circuit design.

Package Style (Meter): FLATPACK

The flatpack style is effective for thermal management and provides a low profile for space-constrained designs.

Minimum Supply Voltage: 1.8 V

The ability to operate at lower voltages allows for energy-efficient designs, extending battery life in portable applications.

Maximum Operating Temperature: 85 °C

This temperature rating ensures functionality in demanding environments, making it suitable for industrial applications.

CPU Family: CORTEX-M0

The Cortex-M0 core is known for its efficiency and low power consumption, making it ideal for battery-powered devices.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to operate in extreme conditions, ensuring reliability in various environments.

ADC Channels: YES

Having ADC channels enables the conversion of analog signals, allowing integration with a variety of sensors.

Terminal Position: QUAD

Quad terminal position aids in effective connectivity and helps in maximizing data transfer efficiency.

ROM Words: 131072

The large ROM allows for substantial program storage, facilitating the development of complex applications.

Width: 7 mm

Compact width helps optimize PCB space, enabling more efficient layouts.

Data EEPROM Size: 4096

Ample EEPROM size allows for data storage and retrieval, enabling applications that require non-volatile memory.

Peripherals: POR, PWM(6), TIMER(5), WDT

A variety of integrated peripherals enhances functionality and reduces the need for additional components, streamlining design.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz ensures decent processing speed for most applications, balancing performance and power consumption.

Length: 7 mm

The compact length helps achieve space efficiency in compact electronics as well.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability for consistent performance in industrial settings.

RAM Bytes: 10240

Substantial RAM size allows for efficient data handling and complex computations, enhancing program performance.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making this microcontroller suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates better soldering and improves mechanical stability.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple ADC channels afford greater versatility in interfacing with analog components, which expands application potential.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V is compatible with most modern digital systems.

PWM Channels: YES

Integrated PWM channels facilitate motor control and other time-sensitive applications without the need for external components.

Connectivity: I2C, SSP(2), UART, USB

Robust connectivity options enable easy interface with various peripherals, enhancing overall system design flexibility.

ROM Programmability: FLASH

Flash ROM allows for easy program updates and modifications, which is essential for iterative design and development.

Terminal Pitch: 0.5 mm

A smaller terminal pitch supports compact routing on PCBs, making it suitable for miniaturized applications.

Speed: 50 rpm

While specific speed is application-dependent, it indicates a microcontroller capable of controlling moderate-speed devices.

On Chip Program ROM Width: 8

The 8-bit program ROM width supports a variety of programming options, enhancing compatibility with existing software ecosystems.

Number of I/O Lines: 40

Having 40 I/O lines allows for extensive interfacing options, making it suitable for a wide range of applications.

Technical Specifications

Microcontrollers LPC11U37FBD48/501, attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

40

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Data EEPROM Size:

4096

Connectivity:

I2C, SSP(2), UART, USB

Peripherals:

POR, PWM(6), TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11U37FBD48/501, Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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