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LPC11U37FBD48/401

NXP Semiconductors

LPC11U37FBD48/401 by NXP Semiconductors

NXP Semiconductors' LPC11U37FBD48/401 is a 32-bit microcontroller with 131072 ROM words, 10240 RAM bytes, and 40 I/O lines. It operates at speeds up to 25 MHz and has ADC and DMA channels for industrial applications requiring a peak reflow temperature of 260°C.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 127 parts In-Stock

1+ parts

$2.870

100+ parts

$2.810

1k+ parts

$2.760

10k+ parts

-

127

$2.870

$2.810

$2.760

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Farnell

UK . 240 parts In-Stock

1+ parts

$4.370

100+ parts

$2.900

1k+ parts

$2.040

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-

240

$4.370

$2.900

$2.040

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Newark

USA . 240 parts In-Stock

1+ parts

$5.150

100+ parts

$3.790

1k+ parts

$3.230

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240

$5.150

$3.790

$3.230

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Element14

Singapore . 59 parts In-Stock

1+ parts

$375.990

100+ parts

$276.700

1k+ parts

$199.320

10k+ parts

$189.100

59

$375.990

$276.700

$199.320

$189.100

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.551

100+ parts

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100

$3.551

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Chip Stock

USA . 25,600 parts In-Stock

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25,600

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Vyrian

USA . 6,267 parts In-Stock

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6,267

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Flip Electronics

USA . 2,164 parts In-Stock

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2,164

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J2 Sourcing AB

Sweden . 1,576 parts In-Stock

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1,576

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Digiode

USA . 1,575 parts In-Stock

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1,575

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Anansix

USA . 879 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,161 parts In-Stock

1+ parts

$3.551

100+ parts

-

1k+ parts

-

10k+ parts

$3.480

6,161

$3.551

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-

$3.480

Argo Parts USA

USA . 536 parts In-Stock

1+ parts

$3.551

100+ parts

-

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536

$3.551

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Vigor

Singapore . 2,501 parts In-Stock

1+ parts

$5.150

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2,501

$5.150

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AZTECH Wire

Italy . 358 parts In-Stock

1+ parts

$10.727

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358

$10.727

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Microchip USA

USA . 3,605 parts In-Stock

1+ parts

$23.977

100+ parts

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3,605

$23.977

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One Stop Electronics

USA . 214 parts In-Stock

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$24.000

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214

$24.000

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Semicontronic

India . 1,181 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

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1,181

$27.000

$26.325

$26.190

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Ampacity Inc.

Singapore . 1,342 parts In-Stock

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$34.000

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1,342

$34.000

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Corohmni

South Africa . 250 parts In-Stock

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$44.258

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250

$44.258

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Aztec Data Supply Inc.

USA . 179 parts In-Stock

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$47.113

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179

$47.113

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Futuretech Components

Singapore . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,549 parts In-Stock

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8,549

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Kepictronics

USA . 3,500 parts In-Stock

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UNI Independent Distributors

Spain . 1,174 parts In-Stock

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Perfect Parts

USA . 728 parts In-Stock

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728

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Corphita

USA . 526 parts In-Stock

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526

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Netroflash

USA . 500 parts In-Stock

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$3.480

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$3.373

10k+ parts

$3.302

500

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$3.480

$3.373

$3.302

iodParts Technologies Inc.

India . 92 parts In-Stock

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92

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Overview

Elevate your projects with the LPC11U37FBD48/401 microcontroller from NXP Semiconductors, a trusted name in the industry. Designed for versatility and efficiency, this 32-bit powerhouse offers a wide range of applications in a compact package. With features like ADC channels, DMA channels, and a maximum clock frequency of 25 MHz, you can expect top-notch performance every time. Whether you're working on industrial automation or IoT devices, this microcontroller delivers unmatched value, benefits, and advantages to meet your needs. Upgrade to the LPC11U37FBD48/401 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, increasing its versatility.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB, ideal for compact designs.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance for demanding applications.

Power Supplies (V): 3.3

The 3.3V power supply ensures stable operation and compatibility with common voltage standards.

No. of Terminals: 48

With 48 terminals, this microcontroller offers ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style provides a sleek and compact design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh conditions and maintain reliable performance.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family offers a balance of performance and energy efficiency, making it an excellent choice for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

ADC Channels: YES

The presence of ADC channels allows for analog input processing, expanding the versatility of the microcontroller.

DMA Channels: YES

DMA channels enable efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connection to the PCB, ensuring reliable operation.

ROM Words: 131072

With a large ROM capacity of 131072 words, this microcontroller can store a significant amount of program data.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm ensures compatibility with compact designs and tight spaces.

Width: 7 mm

The compact width of 7mm enables easy integration into small PCB layouts, ideal for space-constrained applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz allows for fast and efficient processing of instructions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder connections during assembly processes.

Length: 7 mm

The short length of 7mm adds to the microcontroller's compact design, suitable for small form factor applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides efficient and streamlined processing for optimized performance.

RAM Bytes: 10240

With 10240 bytes of RAM, this microcontroller can efficiently store and access data during operation.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and ease of assembly on the PCB.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power delivery for reliable operation.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy and fast updates to the program code.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting on the PCB for efficient use of space.

Speed: 50 rpm

The speed rating of 50 rpm ensures fast and responsive processing for real-time applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows for efficient storage and retrieval of program instructions.

No. of I/O Lines: 40

With 40 I/O lines, this microcontroller offers versatile input and output options for interfacing with external devices.

Technical Specifications

Microcontrollers LPC11U37FBD48/401 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

40

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC11U37FBD48/401 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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