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LPC11U35FHN33/401

NXP Semiconductors

LPC11U35FHN33/401 by NXP Semiconductors

NXP Semiconductors' LPC11U35FHN33/401 is a 32-bit microcontroller with 3.3V supply, operating at -40 to 85°C. Featuring Cortex-M0 CPU, it offers 26 I/O lines, 10240 RAM bytes, and ADC/DMA channels for industrial applications requiring up to 25MHz clock frequency.

Median Price

$6.300

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 260 parts In-Stock

1+ parts

$6.300

100+ parts

$4.070

1k+ parts

$3.740

10k+ parts

$3.650

260

$6.300

$4.070

$3.740

$3.650

DigiKey

USA . 250 parts In-Stock

1+ parts

$6.870

100+ parts

$4.449

1k+ parts

$4.109

10k+ parts

$4.007

250

$6.870

$4.449

$4.109

$4.007

Verical

USA . 9,880 parts In-Stock

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$3.256

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9,880

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$3.256

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Distributors (In-Stock)

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Digiode

USA . 2,623 parts In-Stock

1+ parts

$5.234

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2,623

$5.234

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Vyrian

USA . 6,039 parts In-Stock

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Anansix

USA . 85 parts In-Stock

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85

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Nova Conductors

Japan . 44 parts In-Stock

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NexGen Digital

USA . 2 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 88 parts In-Stock

1+ parts

$4.630

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88

$4.630

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Corphita

USA . 3,037 parts In-Stock

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$4.959

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Microchip USA

USA . 4,611 parts In-Stock

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$20.412

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Corohmni

South Africa . 653 parts In-Stock

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$20.962

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653

$20.962

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UNI Independent Distributors

Spain . 6,355 parts In-Stock

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Lixinc

USA . 6,098 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 100 parts In-Stock

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100

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Overview

Looking for a top-quality microcontroller that offers exceptional performance and reliability? Look no further than the LPC11U35FHN33/401 by NXP Semiconductors. With its cutting-edge technology, this microcontroller is perfect for a wide range of applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, this product has got you covered. Experience the value and benefits that NXP Semiconductors brings to the table with this outstanding microcontroller. Upgrade your projects today with the LPC11U35FHN33/401!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and offers good mechanical strength, making the product durable and affordable.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, reducing production time and cost.

Maximum Supply Voltage: 3.6 V

The high supply voltage allows for compatibility with a wide range of power sources, making the product versatile.

Bit Size: 32

A larger bit size allows for more complex operations and calculations to be performed, making the microcontroller suitable for a variety of applications.

Power Supplies (V): 3.3

The standard power supply voltage of 3.3V ensures compatibility with common power sources and components, making integration easier.

No. of Terminals: 33

With a high number of terminals, the microcontroller can support a variety of input and output connections, increasing its flexibility and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options provide flexibility for different mounting and thermal requirements, allowing for optimal performance in various environments.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables the microcontroller to operate efficiently even with lower power sources, making it energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, increasing the product's durability.

CPU Family: CORTEX-M0

Being in the Cortex-M0 family, the microcontroller offers a good balance between performance and power efficiency, suitable for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The peripheral IC type of microcontroller coupled with the RISC architecture ensures efficient processing and control capabilities, making it a reliable choice for various tasks.

Technical Specifications

Microcontrollers LPC11U35FHN33/401 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N33

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC11U35FHN33/401 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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