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LPC11U35FBD64/401

NXP Semiconductors

LPC11U35FBD64/401 by NXP Semiconductors

NXP Semiconductors' LPC11U35FBD64/401 is a 32-bit microcontroller with Cortex-M0 CPU, 3.3V supply, and 25MHz clock frequency. Ideal for industrial applications, it features 54 I/O lines, 10240 bytes of RAM, and FLASH ROM programmability for efficient data processing.

Median Price

$3.265

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 166 parts In-Stock

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$3.100

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$2.490

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166

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$2.490

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Rochester

USA . 40,389 parts In-Stock

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-

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$3.430

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$3.070

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$2.890

40,389

-

$3.430

$3.070

$2.890

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$2.981

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10

$2.981

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Digiode

USA . 4,099 parts In-Stock

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$3.296

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$3.296

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DigiKey Marketplace

USA . 42,455 parts In-Stock

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Cyclops Electronics Ltd

UK . 16,000 parts In-Stock

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Chip Stock

USA . 9,500 parts In-Stock

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Vyrian

USA . 6,599 parts In-Stock

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Anansix

USA . 860 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 41,206 parts In-Stock

1+ parts

$2.950

100+ parts

$2.876

1k+ parts

$2.862

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41,206

$2.950

$2.876

$2.862

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Ampacity Inc.

Singapore . 41,139 parts In-Stock

1+ parts

$2.950

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$2.950

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Continental Prestige Electronics

USA . 6,822 parts In-Stock

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$2.981

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$2.922

6,822

$2.981

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$2.922

Argo Parts USA

USA . 2,415 parts In-Stock

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$2.981

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Netroflash

USA . 100 parts In-Stock

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$2.981

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$2.832

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$2.773

100

$2.981

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$2.832

$2.773

Corphita

USA . 543 parts In-Stock

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$3.123

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Vigor

Singapore . 160 parts In-Stock

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$4.760

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AZTECH Wire

Italy . 907 parts In-Stock

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$11.460

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$11.460

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Aztec Data Supply Inc.

USA . 2,416 parts In-Stock

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$16.820

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Corohmni

South Africa . 489 parts In-Stock

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$46.280

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489

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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Lixinc

USA . 18,676 parts In-Stock

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Futuretech Components

Singapore . 8,200 parts In-Stock

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GreenTree Electronics

Israel . 8,000 parts In-Stock

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Microchip USA

USA . 7,776 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,627 parts In-Stock

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UNI Independent Distributors

Spain . 5,511 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,418 parts In-Stock

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Kepictronics

USA . 4,089 parts In-Stock

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Overview

Looking for a high-quality microcontroller that offers top-notch performance and reliability? Look no further than the LPC11U35FBD64/401 by NXP Semiconductors. This versatile device is perfect for a wide range of applications, from IoT devices to consumer electronics. With its advanced features and cutting-edge technology, this microcontroller delivers exceptional value and benefits to customers. Trust NXP Semiconductors for all your microcontroller needs and experience the advantages that the LPC11U35FBD64/401 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while still maintaining safe operating parameters.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities for the microcontroller.

Terminal Finish: TIN

Tin terminal finish ensures good conductivity and reliability of connections.

ADC Channels: YES

Presence of ADC channels allows for analog signal input, increasing the versatility of the microcontroller.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency of the microcontroller.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance of the microcontroller.

No. of I/O Lines: 54

Ample number of I/O lines provide flexibility for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LPC11U35FBD64/401 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

54

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC11U35FBD64/401 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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