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LPC11U24FBD48/401

NXP Semiconductors

LPC11U24FBD48/401 by NXP Semiconductors

NXP Semiconductors' LPC11U24FBD48/401 is a 32-bit microcontroller with 3.6V max supply voltage, ideal for industrial applications. Featuring a Cortex-M0 CPU, it offers 8-Ch 10-Bit ADC channels and USB connectivity. With 8192 bytes of RAM and flash ROM programmability, this MCU operates at up to 25MHz clock frequency.

Median Price

$2.810

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 6,933 parts In-Stock

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-

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$2.810

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$2.520

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$2.370

6,933

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$2.810

$2.520

$2.370

DigiKey

USA . 713 parts In-Stock

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$2.730

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713

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Flip Electronics (Authorized)

USA . 713 parts In-Stock

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713

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Verical

USA . 595 parts In-Stock

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$3.150

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$3.150

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Digiode

USA . 2,233 parts In-Stock

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$2.698

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Cyclops Electronics Ltd

UK . 25,645 parts In-Stock

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Kruse Electronics AG

Switzerland . 9,185 parts In-Stock

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Kruse

Germany . 9,185 parts In-Stock

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Vyrian

USA . 3,297 parts In-Stock

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Flip Electronics

USA . 713 parts In-Stock

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713

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Anansix

USA . 538 parts In-Stock

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Semicontronic

India . 5,962 parts In-Stock

1+ parts

$2.320

100+ parts

$2.262

1k+ parts

$2.250

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5,962

$2.320

$2.262

$2.250

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Ampacity Inc.

Singapore . 2,684 parts In-Stock

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$2.320

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Corphita

USA . 4,510 parts In-Stock

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Microchip USA

USA . 2,101 parts In-Stock

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$13.142

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Aztec Data Supply Inc.

USA . 261 parts In-Stock

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$18.960

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261

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Corohmni

South Africa . 379 parts In-Stock

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$74.659

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Kepictronics

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Perfect Parts

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Authorized Procurement Solutions

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Lixinc

USA . 9,370 parts In-Stock

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Continental Prestige Electronics

USA . 6,969 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,925 parts In-Stock

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UNI Independent Distributors

Spain . 3,695 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,283 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 25 parts In-Stock

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Overview

Unlock endless possibilities with the LPC11U24FBD48/401 microcontroller from NXP Semiconductors. Designed with cutting-edge technology and expertise, this powerful device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides reliability, efficiency, and innovation. Experience seamless connectivity, high-speed processing, and versatile peripherals all in one compact package. Elevate your projects with the LPC11U24FBD48/401 and witness the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring reliable performance in different environments.

Surface Mount: YES

Facilitates easier and more efficient integration of the microcontroller onto PCBs, reducing assembly time and costs.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the microcontroller within a safe voltage range, suitable for various applications.

Bit Size: 32

A 32-bit architecture enables faster processing speeds and improved performance for complex tasks and calculations.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures consistent operation and reliable functionality of the microcontroller.

No. of Terminals: 48

Sufficient terminals provide ample connectivity options and flexibility for interfacing the microcontroller with other components or peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style allows for compact and space-saving design integration, ideal for applications with limited space constraints.

Minimum Supply Voltage: 1.8 V

Allows for lower power operation and energy-efficient performance, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable operation in challenging environments or industrial applications.

CPU Family: CORTEX-M0

Based on the efficient Cortex-M0 architecture, providing a balance between performance and power consumption for a wide range of applications.

Minimum Operating Temperature: -40 °C

Withstands low temperatures, making it suitable for use in harsh environmental conditions or automotive applications.

Technical Specifications

Microcontrollers LPC11U24FBD48/401 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

40

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

I2C, SSP(2), USB

Peripherals:

BOD, COMPARATOR, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11U24FBD48/401 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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