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LPC11U14FET48/201

NXP Semiconductors

LPC11U14FET48/201 by NXP Semiconductors

LPC11U14FET48/201 by NXP is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85 °C. It features 8 ADC channels, 6144 bytes of RAM, and supports I2C, USB connectivity. Ideal for industrial applications requiring compact design and reliability.

Median Price

$2.526

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,800 parts In-Stock

1+ parts

-

100+ parts

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$2.526

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9,800

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$2.526

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DigiKey

USA . 895 parts In-Stock

1+ parts

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100+ parts

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$2.360

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895

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$2.360

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Flip Electronics (Authorized)

USA . 895 parts In-Stock

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895

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Rochester

USA . 861 parts In-Stock

1+ parts

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100+ parts

$2.670

1k+ parts

$2.390

10k+ parts

$2.250

861

-

$2.670

$2.390

$2.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,113 parts In-Stock

1+ parts

$2.337

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2,113

$2.337

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Vyrian

USA . 10,378 parts In-Stock

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10,378

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Anansix

USA . 2,576 parts In-Stock

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2,576

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Flip Electronics

USA . 1,875 parts In-Stock

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1,875

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DigiKey Marketplace

USA . 861 parts In-Stock

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861

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,430 parts In-Stock

1+ parts

$2.214

100+ parts

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4,430

$2.214

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QUARKTWIN TECHNOLOGY LTD

USA . 17,294 parts In-Stock

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Microchip USA

USA . 10,271 parts In-Stock

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10,271

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UNI Independent Distributors

Spain . 3,286 parts In-Stock

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3,286

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iodParts Technologies Inc.

India . 489 parts In-Stock

1+ parts

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$4.333

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489

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$4.333

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Overview

Unlock innovation with the LPC11U14FET48/201 microcontroller from NXP Semiconductors, renowned for unmatched quality and reliability. Designed for diverse applications, it excels in industrial automation, IoT devices, and consumer electronics. Enjoy robust performance, energy efficiency, and extensive connectivity options that empower your projects. Trust NXP's expertise to bring your ideas to life, enhancing productivity and driving success. Choose the future; choose LPC11U14FET48/201.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and efficient placement on printed circuit boards (PCBs).

Maximum Supply Voltage: 3.6 V

The maximum supply voltage allows for a wide range of applications while ensuring compatibility with various systems.

Package Shape: SQUARE

The square package shape aids in efficient use of board space and simplifies thermal management.

Bit Size: 32

A 32-bit architecture enables extensive processing power and larger addressable memory space.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options without sacrificing performance.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array style offers excellent electrical performance and supports high-density layouts.

Minimum Supply Voltage: 1.8 V

Low supply voltage capability minimizes power consumption, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function in temperatures as low as -40 °C increases the versatility for extreme environments.

ADC Channels: YES

Integrated ADC channels enhance the device’s ability to interact with analog signals, expanding application capabilities.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better thermal dissipation and compact PCB designs.

ROM Words: 32,768

A significant amount of ROM enables more complex applications and greater functionality.

Maximum Seated Height: 1.1 mm

The low height increases flexibility in design, particularly for space-constrained applications.

Width: 4.5 mm

Compact width enables integration into small devices and designs.

Peripherals: BOD, PMU, POR, TIMER(4), WDT

A variety of integrated peripherals allows for versatile functionalities in embedded systems.

Maximum Clock Frequency: 25 MHz

25 MHz clock frequency provides adequate speed for complex processing tasks.

Peak Reflow Temperature °C: 260

This high reflow temperature compatibility ensures resilience during manufacturing processes.

Length: 4.5 mm

The compact length further supports integration into limited space applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies reliability in a variety of harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture promotes efficient processing and reduces power consumption.

RAM Bytes: 6,144

Sufficient RAM allows for smooth operation of more complex algorithms and applications.

Technology: CMOS

CMOS technology enhances performance and minimizes power usage, making it ideal for various applications.

Terminal Form: BALL

Ball terminal form provides reliable connections and simplifies manufacturing and assembly.

Analog To Digital Converters: 8-Ch 10-Bit

The presence of an 8-channel, 10-bit ADC enhances versatility in data acquisition tasks.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V aligns with many modern digital logic levels.

Connectivity: I2C, RS-485, SSP(2), USART, USB

Diverse connectivity options facilitate communication in various applications, enhancing integration capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, making the product adaptable to evolving needs.

Terminal Pitch: 0.5 mm

A fine 0.5 mm terminal pitch enables denser designs while maintaining signal integrity.

Speed: 50 rpm

The ability to support speeds up to 50 rpm is suitable for a wide range of motion control applications.

On Chip Program ROM Width: 8

An 8-bit ROM width allows efficient data operation for a variety of embedded applications.

No. of I/O Lines: 40

40 I/O lines allow for extensive interfacing capabilities with other devices and components.

Technical Specifications

Microcontrollers LPC11U14FET48/201 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B48

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

40

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

4.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, RS-485, SSP(2), USART, USB

Peripherals:

BOD, PMU, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11U14FET48/201 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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