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LPC11U14FBD48/201

NXP Semiconductors

LPC11U14FBD48/201 by NXP Semiconductors

LPC11U14FBD48/201 from NXP is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85 °C. It features 8 ADC channels, 6144 bytes of RAM, and supports various connectivity options like USB and I2C. Ideal for industrial applications requiring compact design and reliable performance.

Median Price

$2.330

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 8,929 parts In-Stock

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Verical

USA . 8,060 parts In-Stock

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$14.336

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Rochester

USA . 3,645 parts In-Stock

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$2.330

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$2.080

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$1.960

3,645

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$2.330

$2.080

$1.960

DigiKey

USA . 638 parts In-Stock

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$2.270

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638

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$2.270

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Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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DigiKey Marketplace

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Vyrian

USA . 7,449 parts In-Stock

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Flip Electronics

USA . 4,638 parts In-Stock

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Digiode

USA . 3,824 parts In-Stock

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Anansix

USA . 1,706 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 4,526 parts In-Stock

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$26.068

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$26.068

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Ampacity Inc.

Singapore . 8,826 parts In-Stock

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$29.000

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Perfect Parts

USA . 10,407 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,402 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,601 parts In-Stock

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Corphita

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Futuretech Components

Singapore . 1,500 parts In-Stock

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S.R.D Solutions

India . 1,500 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

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Vigor

Singapore . 235 parts In-Stock

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GreenTree Electronics

Israel . 138 parts In-Stock

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UNI Independent Distributors

Spain . 110 parts In-Stock

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Overview

Elevate your designs with the LPC11U14FBD48/201 microcontroller from NXP Semiconductors, a trusted leader in innovative technology. This powerful 32-bit solution excels in efficiency and versatility, perfect for industrial applications where reliability is key. With low power consumption and robust connectivity options, it seamlessly integrates into various projects, ensuring optimal performance and long-term value that promotes creativity without compromising quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against environmental factors, enhancing the reliability of the microcontroller.

Surface Mount: YES

Surface mount technology allows for compact designs, making it easy to integrate into modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of power supplies, accommodating diverse applications.

Package Shape: SQUARE

The square shape facilitates efficient space usage on PCBs, which is beneficial for compact designs.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers enhanced processing capabilities for complex applications requiring high performance.

No. of Terminals: 48

A higher number of terminals allows for increased connectivity options, making it versatile for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is ideal for applications where space is at a premium, enabling lower profile designs.

Minimum Supply Voltage: 1.8 V

This low minimum supply voltage allows for energy-efficient designs, suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures that this microcontroller can function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

With operation down to -40 °C, this microcontroller is suitable for extreme conditions, making it ideal for industrial applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital, essential for sensor integrations.

Terminal Position: QUAD

Quad terminal positioning facilitates better insertion and soldering, resulting in improved assembly efficiency.

ROM Words: 32768

A considerable amount of ROM storage allows for complex code to be embedded directly into the microcontroller.

Maximum Seated Height: 1.6 mm

The low seated height reduces the overall profile of the device, helping to design slimmer electronics.

Width: 7 mm

A compact width enhances design flexibility and allows the microcontroller to fit into smaller spaces.

Peripherals: BOD, PMU, POR, TIMER(4), WDT

A diverse range of peripherals enables advanced control features and improves system performance.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency ensures swift processing, facilitating responsiveness in real-time applications.

Peak Reflow Temperature °C: 260

Ability to withstand high reflow temperatures makes it suitable for modern high-temperature soldering techniques.

Length: 7 mm

The compact length allows for space-efficient mounting on PCBs, making it suitable for dense circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades ensures reliability in harsh operating conditions, ideal for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high instruction efficiency, contributing to overall performance enhancements.

RAM Bytes: 6144

A significant amount of RAM supports complex data processing, making it suitable for advanced applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals help with easy alignment and soldering during PCB assembly, improving manufacturing efficiency.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADCs enable the connection of several analog sensors, making it versatile for various measurement applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V is standard for many microcontroller applications, ensuring compatibility with common components.

Connectivity: I2C, RS-485, SSP(2), USART, USB

Diverse connectivity options allow for seamless integration into various systems, enhancing its application range.

ROM Programmability: FLASH

Flash ROM allows for easy updates and modifications of the embedded program, increasing usability across projects.

Terminal Pitch: 0.5 mm

A fine terminal pitch is suitable for compact layouts, allowing for maximum I/O in minimal space.

Speed: 50 rpm

Although a specific speed is mentioned, it is likely associated with peripheral operations, highlighting the microcontroller's versatility.

On Chip Program ROM Width: 8

8-bit wide ROM architecture can optimize code execution, making it efficient for tasks requiring a lightweight footprint.

No. of I/O Lines: 40

A rich I/O line count provides extensive interfacing capabilities, allowing connections to numerous peripheral devices.

Technical Specifications

Microcontrollers LPC11U14FBD48/201 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

40

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, RS-485, SSP(2), USART, USB

Peripherals:

BOD, PMU, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11U14FBD48/201 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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