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LPC11U12FBD48/201

NXP Semiconductors

LPC11U12FBD48/201 by NXP Semiconductors

LPC11U12FBD48/201 from NXP is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85 °C. It features 8 ADC channels, 6144 bytes of RAM, and supports I2C, USB connectivity. Ideal for industrial applications requiring robust performance.

Median Price

$4.450

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 360 parts In-Stock

1+ parts

$3.614

100+ parts

$2.196

1k+ parts

$2.164

10k+ parts

-

360

$3.614

$2.196

$2.164

-

DigiKey

USA . 204 parts In-Stock

1+ parts

$4.450

100+ parts

$2.805

1k+ parts

$2.508

10k+ parts

$2.434

204

$4.450

$2.805

$2.508

$2.434

Chip1Stop

Japan . 360 parts In-Stock

1+ parts

$4.989

100+ parts

-

1k+ parts

$2.398

10k+ parts

-

360

$4.989

-

$2.398

-

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$5.950

100+ parts

$3.350

1k+ parts

$2.620

10k+ parts

$2.550

250

$5.950

$3.350

$2.620

$2.550

Flip Electronics (Authorized)

USA . 16,582 parts In-Stock

1+ parts

-

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16,582

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Verical

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$2.196

1k+ parts

$2.164

10k+ parts

-

360

-

$2.196

$2.164

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,732 parts In-Stock

1+ parts

$2.816

100+ parts

-

1k+ parts

-

10k+ parts

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2,732

$2.816

-

-

-

Flip Electronics

USA . 8,291 parts In-Stock

1+ parts

-

100+ parts

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8,291

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Vyrian

USA . 5,377 parts In-Stock

1+ parts

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5,377

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Anansix

USA . 1,493 parts In-Stock

1+ parts

-

100+ parts

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1,493

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,776 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

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2,776

$1.800

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-

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Corphita

USA . 2,333 parts In-Stock

1+ parts

$2.668

100+ parts

-

1k+ parts

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10k+ parts

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2,333

$2.668

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Vigor

Singapore . 346 parts In-Stock

1+ parts

$3.900

100+ parts

-

1k+ parts

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346

$3.900

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Microchip USA

USA . 2,443 parts In-Stock

1+ parts

$32.175

100+ parts

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1k+ parts

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10k+ parts

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2,443

$32.175

-

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UNI Independent Distributors

Spain . 7,887 parts In-Stock

1+ parts

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100+ parts

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7,887

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SIE Connect GmbH (Excess)

Germany . 1,250 parts In-Stock

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1,250

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Unlock the power of innovation with the LPC11U12FBD48/201 microcontroller from NXP Semiconductors, a trusted leader in cutting-edge technology. This compact yet powerful 32-bit solution is designed for versatility, making it ideal for industrial applications, IoT devices, and consumer electronics. With exceptional reliability and a wide operational temperature range, it ensures consistent performance even in challenging environments, delivering unmatched value and efficiency to your projects. Elevate your designs with NXP’s commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern electronic assemblies.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is energy-efficient, ideal for battery-operated devices.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on PCBs, fitting well in compact designs.

Bit Size: 32

A 32-bit architecture allows for faster processing capabilities and improved performance for complex computations.

No. of Terminals: 48

The 48 terminals provide ample connectivity options, enabling a versatile range of peripheral connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is excellent for modern electronics where low profile and fine pitch are necessary for space-saving designs.

Minimum Supply Voltage: 1.8 V

The ability to operate at a minimum voltage of 1.8 V enhances power efficiency and allows for compatibility with low-power applications.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C indicates reliability in higher temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures functionality in extreme conditions, making it a great choice for outdoor devices.

Terminal Finish: TIN

Tin terminal finish contributes to better solderability and improved reliability in device assemblies.

ADC Channels: YES

Inclusion of ADC channels allows for analog signal processing, making this microcontroller versatile for various applications.

Terminal Position: QUAD

Quad terminal positioning allows for effective space usage and simplified routing on circuit boards.

ROM Words: 16384

With 16384 ROM words, there's ample space for program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

A low seated height ensures compatibility with compact and space-restricted designs.

Width: 7 mm

The compact width aids in the design of space-efficient systems, especially for portable devices.

Peripherals: BOD, PMU, POR, TIMER(4), WDT

A variety of peripherals enhances functionality, providing necessary features for robust application development.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency supports faster processing speeds, making it suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller withstands high temperatures during assembly, ensuring durability through manufacturing processes.

Peak Reflow Temperature °C: 260

Designed to handle peak reflow temperatures, it is ideal for lead-free soldering and modern manufacturing practices.

Length: 7 mm

The compact length is beneficial for devices where board space is at a premium.

Temperature Grade: INDUSTRIAL

Industrial-grade ratings ensure reliability and performance in tough environmental conditions, ideal for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture leads to efficient processing and lower power consumption, ideal for a wide variety of applications.

RAM Bytes: 6144

With 6144 bytes of RAM, it enables multitasking and efficient data handling, suitable for complex operations.

Technology: CMOS

CMOS technology offers low power consumption and high integration levels, making it ideal for portable and battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals are widely compatible with automated assembly processes, enhancing manufacturability.

Analog To Digital Converters: 8-Ch 10-Bit

The 8-channel 10-bit ADC enables high-resolution analog inputs, allowing for accurate data acquisition in various applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3 V is standard for many systems, ensuring compatibility with other components.

Connectivity: I2C, RS-485, SSP(2), USART, USB

The wide variety of connectivity options allows for integration into numerous systems and devices, enhancing versatility.

ROM Programmability: FLASH

Flash programmability allows for easy software updates and modifications, streamlining the development process.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense packing of components, making high-performance designs feasible.

Speed: 50 rpm

A speed rating of 50 rpm supports a range of applications, particularly in control systems requiring moderate speed.

On Chip Program ROM Width: 8

The 8-bit program ROM width supports efficient operations, ensuring compatibility with various peripherals and systems.

No. of I/O Lines: 40

Having 40 I/O lines provides abundant interfacing options for multiple external devices, fostering broader application support.

Technical Specifications

Microcontrollers LPC11U12FBD48/201 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

40

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, RS-485, SSP(2), USART, USB

Peripherals:

BOD, PMU, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11U12FBD48/201 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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