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LPC1115JET48/303QL

NXP Semiconductors

LPC1115JET48/303QL by NXP Semiconductors

LPC1115JET48/303QL by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 8-channel ADC, and operates in -40 °C to 105 °C range. Ideal for industrial applications, it supports I2C, SPI, and UART connectivity. Its compact design ensures efficient performance in embedded systems.

Median Price

$2.790

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,800 parts In-Stock

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$2.790

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$2.790

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Distributors (In-Stock)

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Flip Electronics

USA . 6,860 parts In-Stock

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6,860

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Vyrian

USA . 5,760 parts In-Stock

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5,760

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Digiode

USA . 3,887 parts In-Stock

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Anansix

USA . 107 parts In-Stock

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107

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Distributors (Availability)

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Vigor

Singapore . 4,722 parts In-Stock

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$2.080

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One Stop Electronics

USA . 1,234 parts In-Stock

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$4.000

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Ampacity Inc.

Singapore . 756 parts In-Stock

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$9.000

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756

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AZTECH Wire

Italy . 806 parts In-Stock

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$10.520

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Microchip USA

USA . 3,983 parts In-Stock

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UNI Independent Distributors

Spain . 3,518 parts In-Stock

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Corphita

USA . 1,937 parts In-Stock

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Overview

Elevate your projects with the LPC1115JET48/303QL microcontroller from NXP Semiconductors, a leader in innovative technology. This robust 32-bit solution harnesses efficiency and reliability, making it ideal for industrial applications, IoT devices, and more. With a wide operating temperature range and versatile connectivity options, enjoy seamless integration and enhanced performance. Trust in NXP's quality to unlock new possibilities and propel your designs forward with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures longevity and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient, compact design and easier assembly in automated manufacturing processes.

Maximum Supply Voltage: 3.6 V

With a maximum voltage of 3.6 V, this microcontroller is ideal for low-power applications, ensuring energy efficiency.

Package Shape: SQUARE

The square package shape allows for efficient board layout and helps in maximizing space on PCBs.

Bit Size: 32

A 32-bit architecture enables complex computations and high-performance applications, which enhances the capabilities of the microcontroller.

Power Supplies (V): 3.3

Running on 3.3 V makes this microcontroller compatible with a wide range of devices and power sources, enhancing flexibility.

No. of Terminals: 48

The 48 terminals allow for extensive connectivity options, enabling a wide array of peripherals to be connected.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array packaging enables high-density mounting, which is beneficial for compact electronic designs.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V allows for operation in lower power scenarios, further extending the microcontroller's adaptability.

Maximum Operating Temperature: 105 °C

The ability to operate up to 105 °C makes this microcontroller suitable for industrial and high-temperature environments.

CPU Family: CORTEX-M0

The Cortex-M0 which is known for its efficiency and performance, offers excellent processing power for embedded applications.

Minimum Operating Temperature: -40 °C

Operating in temperatures down to -40 °C allows for use in harsh environments, increasing versatility.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to handle analog signals effectively, expanding its application scope.

Terminal Position: BOTTOM

Bottom terminal positioning allows for space-efficient layouts and makes the device more accessible in compact assemblies.

ROM Words: 65536

With a substantial ROM word count, it facilitates storage for more complex applications and firmware.

Width: 4.5 mm

A compact width of 4.5 mm is ideal for space-constrained designs, allowing for flexibility in handling and placement.

Peripherals: BOD, POR, TIMER(5), WDT

Integrated peripherals add functionality and reduce external component count, simplifying circuit designs.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency provides a good balance of speed and power efficiency for many embedded applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with lead-free soldering processes, aligning with modern manufacturing standards.

Length: 4.5 mm

At 4.5 mm in length, this component contributes to small form-factor designs, ideal for portable and compact applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness and reliability for applications in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it minimizes the instruction set, leading to faster execution and lower power consumption.

RAM Bytes: 8192

With 8192 bytes of RAM, it provides sufficient workspace for data manipulation and processing during execution.

Technology: CMOS

CMOS technology ensures improved power efficiency and performance, vital for battery-operated devices.

Terminal Form: BALL

Ball terminal form factor enhances soldering reliability and allows for better heat dissipation compared to traditional pins.

Analog To Digital Convertors: 8-Ch 10-Bit

The 8-channel 10-bit ADC allows for the integration of various sensors, making it perfect for multi-sensor applications.

Nominal Supply Voltage: 3.3 V

The nominal voltage of 3.3 V supports low-power designs while maintaining adequate performance for most applications.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options like I2C, SPI, and UART make this microcontroller highly versatile and easy to integrate with different devices.

ROM Programmability: FLASH

With FLASH ROM programmability, users can easily update firmware, enhancing the product's life and adaptability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch aids in achieving higher density packaging without compromising on performance.

Speed: 50 rpm

The ability to handle speeds up to 50 rpm indicates suitability for motion control applications and robotic systems.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient storage of program instructions, enhancing the microcontroller’s performance.

Technical Specifications

Microcontrollers LPC1115JET48/303QL attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B48

Length:

4.5 mm

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

4.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1115JET48/303QL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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