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LPC1115FET48/303QL

NXP Semiconductors

LPC1115FET48/303QL by NXP Semiconductors

LPC1115FET48/303QL by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 8-channel 10-bit ADC, and operates in -40 °C to 85 °C range. Ideal for industrial applications, it supports I2C, SPI, and UART connectivity. Its compact design ensures efficient performance in embedded systems.

Median Price

$2.620

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 53 parts In-Stock

1+ parts

-

100+ parts

$2.620

1k+ parts

$2.350

10k+ parts

$2.210

53

-

$2.620

$2.350

$2.210

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,445 parts In-Stock

1+ parts

$2.518

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4,445

$2.518

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Vyrian

USA . 4,302 parts In-Stock

1+ parts

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4,302

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Anansix

USA . 2,516 parts In-Stock

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2,516

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,367 parts In-Stock

1+ parts

$2.385

100+ parts

-

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1,367

$2.385

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Vigor

Singapore . 490 parts In-Stock

1+ parts

$3.640

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490

$3.640

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AZTECH Wire

Italy . 60 parts In-Stock

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$9.980

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60

$9.980

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Microchip USA

USA . 1,944 parts In-Stock

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$36.600

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1,944

$36.600

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Component Stockers USA

USA . 718 parts In-Stock

1+ parts

$99.990

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718

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,981 parts In-Stock

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11,981

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UNI Independent Distributors

Spain . 3,912 parts In-Stock

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3,912

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of innovation with the LPC1115FET48/303QL microcontroller from NXP Semiconductors. Renowned for their commitment to quality and cutting-edge technology, NXP delivers a versatile solution perfect for industrial automation, IoT applications, and more. Enjoy exceptional performance in a compact design, enabling faster development cycles and reduced time-to-market. Elevate your projects with reliability and efficiency that only NXP can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance against environmental factors, making it ideal for various applications.

Surface Mount: YES

Surface mount capability allows for compact design and improved performance in modern electronic circuitry.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V ensures compatibility with low-voltage systems while maintaining power efficiency.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, allowing for more efficient layouts.

Bit Size: 32

A 32-bit architecture provides greater processing power and improved performance for a wide range of applications.

Power Supplies (V): 3.3

3.3 V power supply ensures compatibility with other modern digital devices, enhancing connectivity.

No. of Terminals: 48

With 48 terminals, this microcontroller supports multiple interfaces and functionalities, catering to complex applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array style aids in better signal integrity and thermal performance, crucial for high-speed applications.

Minimum Supply Voltage: 1.8 V

The ability to operate down to 1.8 V increases the flexibility in supply voltage management and power consumption.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliability in moderately harsh environments.

CPU Family: CORTEX-M0

The ARM Cortex-M0 family offers a balance of performance and power efficiency, making it suitable for embedded applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C ensures functionality in extreme environmental conditions.

ADC Channels: YES

Integrated ADC channels enable analog sensor interfacing, expanding the functionality of the microcontroller.

Terminal Position: BOTTOM

Bottom terminal positioning allows for effective heat dissipation and enhances board design flexibility.

ROM Words: 65536

The substantial ROM capacity allows for storing complex firmware and applications directly on the microcontroller.

Width: 4.5 mm

The compact width of 4.5 mm is conducive for space-restricted designs, crucial in portable electronics.

Peripherals: BOD, POR, TIMER(5), WDT

A rich set of peripherals enhances the functionality and reliability of the microcontroller in real-time applications.

Maximum Clock Frequency: 25 MHz

A clock frequency of 25 MHz provides sufficient speed for most control tasks and data processing applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature tolerance of 260 °C ensures reliability during assembly processes.

Length: 4.5 mm

The 4.5 mm length complements the width to create a compact footprint ideal for miniaturized applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this microcontroller ensures reliability in diverse operating environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture promotes efficient instruction execution, making it suitable for low-power applications.

RAM Bytes: 8192

With 8192 bytes of RAM, it supports more dynamic applications, allowing for rich data processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form enhances solder joint reliability and allows for a compact design in multi-chip arrangements.

Analog To Digital Converters: 8-Ch 10-Bit

8-channel 10-bit ADC capability allows for versatile analog signal processing, suitable for various sensor integrations.

Nominal Supply Voltage: 3.3 V

The nominal voltage of 3.3 V aligns with industry standards, ensuring compatibility with a wide range of components.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options like I2C, SPI, and UART provide flexibility in communication protocols for various peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy updates and firmware changes, enhancing product longevity and adaptability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is beneficial for high-density circuit designs, maximizing PCB effectiveness.

Speed: 50 rpm

Operating at a speed of 50 rpm makes the microcontroller suitable for low-speed control applications, enhancing reliability and performance.

On Chip Program ROM Width: 8

An 8-bit width for on-chip program ROM enables effective instruction handling for various applications.

Technical Specifications

Microcontrollers LPC1115FET48/303QL attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B48

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

4.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1115FET48/303QL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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