Loading...

LPC1113JHN33/203E

NXP Semiconductors

LPC1113JHN33/203E by NXP Semiconductors

LPC1113JHN33/203E by NXP is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 105 °C. It features 8 ADC channels, 28 I/O lines, and supports I2C, SPI, and UART for versatile applications in industrial automation. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$2.020

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.020

10k+ parts

-

9,880

-

-

$2.020

-

Flip Electronics (Authorized)

USA . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,835

-

-

-

-

Anansix

USA . 1,392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,392

-

-

-

-

Digiode

USA . 1,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,154

-

-

-

-

Flip Electronics

USA . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,666 parts In-Stock

1+ parts

$4.217

100+ parts

-

1k+ parts

-

10k+ parts

-

1,666

$4.217

-

-

-

Component Stockers USA

USA . 3,685 parts In-Stock

1+ parts

$12.480

100+ parts

-

1k+ parts

-

10k+ parts

-

3,685

$12.480

-

-

-

AZTECH Wire

Italy . 651 parts In-Stock

1+ parts

$21.770

100+ parts

-

1k+ parts

-

10k+ parts

-

651

$21.770

-

-

-

Corphita

USA . 1,471 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,471

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

UNI Independent Distributors

Spain . 312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

312

-

-

-

-

Overview

Unlock the potential of your projects with the LPC1113JHN33/203E microcontroller from NXP Semiconductors, renowned for its quality and performance. This versatile, low-power solution seamlessly integrates into a variety of applications, from IoT devices to industrial automation. Benefit from its robust features, including multiple connectivity options and temperature resilience, ensuring reliability in demanding environments. Elevate your designs with an industry leader committed to innovation and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design with reduced footprint, ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This allows for compatibility with a wide range of power sources, providing flexibility in system design.

Package Shape: SQUARE

A square package shape offers symmetrical layout, facilitating efficient circuit board design and assembly.

Bit Size: 32

The 32-bit architecture enables processing of large data types and performing complex calculations efficiently.

Power Supplies (V): 3.3

Operates at 3.3V, making it suitable for low-power applications and ensuring energy efficiency.

No. of Terminals: 33

With 33 terminals, it provides ample connectivity options for various peripherals and I/O functionalities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style allows for effective heat dissipation while maintaining a slim profile, enhancing performance.

Minimum Supply Voltage: 1.8 V

A low minimum operating voltage makes it suitable for battery-powered applications, extending device longevity.

Maximum Operating Temperature: 105 °C

The high-temperature tolerance ensures reliability in demanding industrial environments.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family is known for its energy efficiency and performance, making it ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Operating in extreme temperatures allows for versatility in various harsh environments.

ADC Channels: YES

Integrated ADC channels provide capabilities for analog signal processing, enhancing functionality in sensing applications.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB design and optimizes layout for reliable connections.

ROM Words: 24576

A significant ROM capacity allows for substantial code storage, enabling complex functionalities.

Width: 7 mm

A compact width facilitates integration into space-limited designs without compromising functionality.

Peripherals: BOD, POR, TIMER(5), WDT

Integrated peripherals enhance the controller's functionality, providing essential features for robust application performance.

Maximum Clock Frequency: 25 MHz

A clock frequency of 25 MHz enables quick data processing, crucial for real-time applications.

Peak Reflow Temperature °C: 260

The capability to withstand high reflow temperatures ensures compatibility with modern manufacturing processes.

Length: 7 mm

Short length enhances compact design possibilities, beneficial for miniaturized devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature performance ensures reliability and durability in demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture enhances efficiency in instruction execution, improving overall performance.

RAM Bytes: 4096

A substantial RAM size allows for efficient data processing and handling of multiple tasks simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for portable devices.

Terminal Form: NO LEAD

No lead design contributes to lower environmental impact and improves assembly techniques.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple ADC channels provide flexibility for integrating various sensors in a single system.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable operation and efficiency in power management.

Connectivity: I2C, SPI(2), UART

Diverse connectivity options facilitate easy integration into various communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, adapting the microcontroller for different applications.

Terminal Pitch: 0.65 mm

Tight terminal pitch enables high-density PCB designs, optimizing board space usage.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 ensures robustness in storage and handling environments.

Speed: 50 rpm

This speed rating indicates capability for applications requiring moderate movement control.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient processing of data while maintaining compatibility with a variety of code sets.

No. of I/O Lines: 28

28 I/O lines provide extensive interfacing possibilities for various peripherals, enhancing overall application flexibility.

Technical Specifications

Microcontrollers LPC1113JHN33/203E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113JHN33/203E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20