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LPC1113JBD48/303QL

NXP Semiconductors

LPC1113JBD48/303QL by NXP Semiconductors

LPC1113JBD48/303QL by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 8 ADC channels, and operates in -40 °C to 105 °C. Ideal for industrial applications, it supports I2C, SPI, and UART connectivity. Its compact design ensures efficient performance in embedded systems.

Median Price

$2.532

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 60 parts In-Stock

1+ parts

$5.790

100+ parts

$3.260

1k+ parts

$2.550

10k+ parts

$2.480

60

$5.790

$3.260

$2.550

$2.480

Flip Electronics (Authorized)

USA . 4,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,250

-

-

-

-

Verical

USA . 4,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.324

10k+ parts

-

4,250

-

-

$2.324

-

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$2.080

1k+ parts

$1.860

10k+ parts

$1.750

250

-

$2.080

$1.860

$1.750

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.740

10k+ parts

-

250

-

-

$2.740

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,730 parts In-Stock

1+ parts

$1.986

100+ parts

-

1k+ parts

-

10k+ parts

-

1,730

$1.986

-

-

-

Flip Electronics

USA . 9,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,750

-

-

-

-

Vyrian

USA . 2,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,807

-

-

-

-

Anansix

USA . 1,453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,453

-

-

-

-

DigiKey Marketplace

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,533 parts In-Stock

1+ parts

$1.881

100+ parts

-

1k+ parts

-

10k+ parts

-

2,533

$1.881

-

-

-

Vigor

Singapore . 210 parts In-Stock

1+ parts

$3.790

100+ parts

-

1k+ parts

-

10k+ parts

-

210

$3.790

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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20,792

-

-

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Microchip USA

USA . 3,745 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,745

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-

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UNI Independent Distributors

Spain . 986 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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986

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-

Overview

Unlock the power of innovation with the LPC1113JBD48/303QL microcontroller from NXP Semiconductors. Renowned for their superior quality and reliability, NXP ensures this product excels in diverse applications—from consumer electronics to industrial automation. Benefit from enhanced efficiency and performance while enjoying robust connectivity options. Elevate your designs with a trusted solution that combines cutting-edge technology with unmatched support, empowering you to transform ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers good durability and is suitable for various applications, ensuring reliability in different environments.

Surface Mount: YES

Surface mount technology enables efficient use of space on PCBs, making the microcontroller ideal for compact designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows compatibility with a wide range of power sources commonly used in electronics.

Package Shape: SQUARE

The square shape facilitates easy layout and placement on PCBs, enhancing design flexibility.

Bit Size: 32

With a 32-bit architecture, this microcontroller can efficiently handle complex computations and larger data sets.

Power Supplies (V): 3.3

Operates at 3.3 V, making it suitable for low-power applications and battery-powered devices.

No. of Terminals: 48

A generous number of terminals supports various I/O functions, allowing for extensive connectivity options.

Package Style (Meter): FLATPACK

Flatpack style ensures efficient thermal management and better electrical performance in compact designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage extends battery life and enhances power efficiency in portable applications.

Maximum Operating Temperature: 105 °C

High temperature tolerance ensures reliable operation in harsh environments, making it suitable for industrial applications.

CPU Family: CORTEX-M0

The Cortex-M0 family provides a balance of performance and energy efficiency, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Wide temperature operating range makes it robust for outdoor and extreme environment applications.

Terminal Finish: TIN

Tin finish improves solderability and ensures reliable connections during the manufacturing process.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, reducing the need for external components.

Terminal Position: QUAD

Quad terminal positioning maximizes accessibility and ease of connection on PCBs.

ROM Words: 24576

A substantial ROM capacity supports complex applications and more extensive program storage requirements.

Width: 7 mm

Compact width is ideal for space-constrained designs, making it a versatile choice for various applications.

Peripherals: BOD, POR, TIMER(5), WDT

Built-in peripherals enhance functionality and reduce the need for additional components, streamlining design.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency allows for fast processing speeds, improving the overall performance of applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperature protects the microcontroller during assembly processes.

Peak Reflow Temperature °C: 260

High reflow temperature capability ensures compatibility with robust soldering processes, enhancing durability.

Length: 7 mm

Compact length complements its width, providing an overall small footprint for efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability across a wide range of operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture promotes efficient instruction execution, resulting in optimized performance and energy consumption.

RAM Bytes: 8192

With 8192 bytes of RAM, it can manage multiple tasks effectively, making it suitable for complex applications.

Technology: CMOS

CMOS technology delivers low power consumption, making it ideal for battery-operated and energy-sensitive devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint visibility, simplifying assembly and maintenance.

Analog To Digital Converters: 8-Ch 10-Bit

Integrated 8-channel 10-bit ADCs allow for versatile signal conversion, useful in various measurement applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage is optimal for many modern electronics, ensuring device compatibility.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options enhance integration capabilities with other devices and sensors.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications to the firmware, ensuring future-proof design.

Terminal Pitch: 0.5 mm

Narrow terminal pitch is ideal for densely packed PCBs, maximization of space.

Speed: 50 rpm

Provides adequate processing speed for applications requiring real-time data processing without noticeable latency.

On Chip Program ROM Width: 8

An 8-bit on-chip program ROM width optimizes data handling and allows efficient instruction sets.

No. of I/O Lines: 42

A high number of I/O lines enhances flexibility and compatibility with various peripherals and sensors.

Technical Specifications

Microcontrollers LPC1113JBD48/303QL attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

42

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113JBD48/303QL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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