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LPC1113FHN33/302,5

NXP Semiconductors

LPC1113FHN33/302,5 by NXP Semiconductors

LPC1113FHN33/302,5 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile applications in industrial automation. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$2.151

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 100 parts In-Stock

1+ parts

$3.050

100+ parts

$2.460

1k+ parts

$2.100

10k+ parts

-

100

$3.050

$2.460

$2.100

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Chip1Stop

Japan . 71 parts In-Stock

1+ parts

$4.410

100+ parts

$2.130

1k+ parts

$1.890

10k+ parts

$1.760

71

$4.410

$2.130

$1.890

$1.760

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

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$1.879

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9,880

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-

$1.879

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Rochester

USA . 3,458 parts In-Stock

1+ parts

-

100+ parts

$1.990

1k+ parts

$1.780

10k+ parts

$1.670

3,458

-

$1.990

$1.780

$1.670

Avnet

USA . 520 parts In-Stock

1+ parts

-

100+ parts

-

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$2.151

10k+ parts

$1.990

520

-

-

$2.151

$1.990

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,877 parts In-Stock

1+ parts

$1.738

100+ parts

-

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1,877

$1.738

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DF Sales Co.

USA . 10 parts In-Stock

1+ parts

$4.000

100+ parts

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-

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10

$4.000

-

-

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DF Sales Co.

USA . 10 parts In-Stock

1+ parts

$4.000

100+ parts

-

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10

$4.000

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Vyrian

USA . 8,309 parts In-Stock

1+ parts

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8,309

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Flip Electronics

USA . 7,800 parts In-Stock

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7,800

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Anansix

USA . 4,331 parts In-Stock

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4,331

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Distributors (Availability)

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Corphita

USA . 9,147 parts In-Stock

1+ parts

$1.647

100+ parts

-

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-

10k+ parts

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9,147

$1.647

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Continental Prestige Electronics

USA . 100 parts In-Stock

1+ parts

$2.110

100+ parts

$1.480

1k+ parts

$1.080

10k+ parts

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100

$2.110

$1.480

$1.080

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AZTECH Wire

Italy . 200 parts In-Stock

1+ parts

$11.330

100+ parts

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200

$11.330

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Microchip USA

USA . 14,923 parts In-Stock

1+ parts

$13.733

100+ parts

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14,923

$13.733

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UNI Independent Distributors

Spain . 5,772 parts In-Stock

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5,772

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Component Stockers USA

USA . 300 parts In-Stock

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300

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Perfect Parts

USA . 291 parts In-Stock

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291

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Overview

Elevate your next project with the LPC1113FHN33/302,5 microcontroller from NXP Semiconductors. Renowned for their reliability and innovation, NXP delivers a powerhouse that excels in low-power applications with robust performance. Featuring a compact design, this versatile 32-bit controller integrates seamlessly into various systems, offering exceptional connectivity options like I2C, SPI, and UART. Leverage NXP's industry-leading quality to power your devices efficiently and effectively!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Supports surface mount technology, allowing for a more compact design and easier integration into PCBs.

Maximum Supply Voltage: 3.6 V

Allows flexibility in power supply options, ensuring compatibility with a variety of systems.

Package Shape: SQUARE

Square package design ensures efficient use of space on circuit boards and simplifies assembly.

Bit Size: 32

A 32-bit architecture allows for more complex computing and efficient processing capabilities.

Power Supplies (V): 3.3

Optimized for 3.3V supply voltage, which is commonly used in modern electronic devices.

No. of Terminals: 33

Provides ample I/O options for interfacing with other components in a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Thin profile aids in space-constrained applications and improves thermal management.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enhances energy efficiency and allows operation in battery-powered devices.

Maximum Operating Temperature: 85 °C

High operating temperature rating suitable for industrial applications, ensuring reliability in harsh environments.

CPU Family: CORTEX-M0

Based on the efficient ARM Cortex-M0 architecture, providing a good balance of performance and power consumption.

Minimum Operating Temperature: -40 °C

Wide operating temperature range supports extreme environments, ideal for industrial or automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent solderability and corrosion resistance.

ADC Channels: YES

Availability of ADC channels enhances capability to process analog signals, improving versatility.

Terminal Position: QUAD

Quad terminal position allows for easier soldering and better electrical performance.

ROM Words: 24576

Sufficient ROM capacity for program storage, enabling complex applications.

Width: 7 mm

Compact width facilitates integration into space-limited designs.

Peripherals: BOD, POR, TIMER(5), WDT

Built-in peripherals enhance functionality and reduce external component requirements.

Maximum Clock Frequency: 25 MHz

Decent clock frequency for real-time operations, ensuring responsive performance.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized for soldering processes, ensuring reliable assembly without damaging the chip.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance, suitable for various PCB assembly techniques.

Length: 7 mm

Compact length perfect for designs where space is at a premium.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides better performance per watt, making it effective for low-power applications.

RAM Bytes: 8192

Adequate RAM capacity suitable for various applications, allowing for efficient data handling.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: NO LEAD

No-lead terminal design aids in low-profile applications and minimizes interference.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple ADC channels with good resolution enhance the ability to process and manage analog signals.

Nominal Supply Voltage: 3.3 V

Standard operating voltage aligns with most electronic components, simplifying design.

Connectivity: I2C, SPI, UART

Versatile connectivity options allow for easy communication with various external devices.

ROM Programmability: FLASH

Flash programmability offers easy updates and flexibility in firmware management.

Terminal Pitch: 0.65 mm

Fine pitch allows for denser layout designs on PCBs, maximizing board real estate.

Moisture Sensitivity Level (MSL): 3

MSL 3 means suitable for standard assembly processes, with certain moisture precautions.

Speed: 50 rpm

Speed specifications indicate capability for specific applications requiring controlled processing.

On Chip Program ROM Width: 8

8-bit ROM width provides adequate granularity for a variety of programming needs.

No. of I/O Lines: 28

A good number of I/O lines available for extensive connections and functionalities.

Technical Specifications

Microcontrollers LPC1113FHN33/302,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113FHN33/302,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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